Prachi Shukla

Publication Activity (10 Years)

Years Active: 2019-2024
Publications (10 Years): 10

Top Topics

Scientific Communities

Integrated Circuit

Image Reconstruction From Projections

Top Venues

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.

IEEE Trans. Circuits Syst. II Express Briefs

Publications

Prachi Shukla, Vasilis F. Pavlidis, Emre Salman, Ayse K. Coskun
A New Dataflow Implementation to Improve Energy Efficiency of Monolithic 3D Systolic Arrays. CoRR (2024)
Prachi Shukla, Vasilis F. Pavlidis, Emre Salman, Ayse K. Coskun
TREAD-M3D: Temperature-Aware DNN Accelerators for Monolithic 3-D Mobile Systems. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42 (12) (2023)
Prachi Shukla, Derrick Aguren, Tom Burd, Ayse K. Coskun, John Kalamatianos
Temperature-Aware Sizing of Multi-Chip Module Accelerators for Multi-DNN Workloads. DATE (2023)
Prachi Shukla, Vasilis F. Pavlidis, Emre Salman, Ayse K. Coskun
Temperature-Aware Monolithic 3D DNN Accelerators for Biomedical Applications. CoRR (2022)
Zihao Yuan, Prachi Shukla, Sofiane Chetoui, Sean S. Nemtzow, Sherief Reda, Ayse K. Coskun
PACT: An Extensible Parallel Thermal Simulator for Emerging Integration and Cooling Technologies. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41 (4) (2022)
Krithika Dhananjay, Prachi Shukla, Vasilis F. Pavlidis, Ayse K. Coskun, Emre Salman
Monolithic 3D Integrated Circuits: Recent Trends and Future Prospects. IEEE Trans. Circuits Syst. II Express Briefs 68 (3) (2021)
Prachi Shukla, Sean S. Nemtzow, Vasilis F. Pavlidis, Emre Salman, Ayse K. Coskun
Temperature-Aware Optimization of Monolithic 3D Deep Neural Network Accelerators. ASP-DAC (2021)
Zihao Yuan, Geoffrey Vaartstra, Prachi Shukla, Zhengmao Lu, Evelyn Wang, Sherief Reda, Ayse K. Coskun
A Learning-Based Thermal Simulation Framework for Emerging Two-Phase Cooling Technologies. DATE (2020)
Zihao Yuan, Geoffrey Vaartstra, Prachi Shukla, Sherief Reda, Evelyn Wang, Ayse K. Coskun
Modeling and Optimization of Chip Cooling with Two-Phase Vapor Chambers. ISLPED (2019)
Prachi Shukla, Ayse K. Coskun, Vasilis F. Pavlidis, Emre Salman
An Overview of Thermal Challenges and Opportunities for Monolithic 3D ICs. ACM Great Lakes Symposium on VLSI (2019)