Methodology for Active Junction Profile Extraction in thin film FD-SOI Enabling performance driver identification in 500°C devices for 3D sequential integration.
Tadeu Mota FrutuosoXavier GarrosPerrine BatudeLaurent BrunetJoris LacordB. SklenardV. LaprasClaire Fenouillet-BérangerM. RibottaA. Magalhaes-LucasJ. KanyandekweR. KiesG. RomanoEdoardo CatapanoMikaël CasséJose Lugo-AlvarezP. FerrariFred GaillardPublished in: VLSI Technology and Circuits (2022)