Léa Di Cioccio

Publication Activity (10 Years)

Years Active: 2007-2022
Publications (10 Years): 1

Top Topics

Semiconductor Manufacturing

Magnetic Recording

Integrated Circuit

Top Venues

Publications

Josua Guérid, Jean-Baptiste Doré, Jacques Reverdy, Bruno Reig, Antonio Clemente, Léa Di Cioccio
Toward Eco-Design of a 5G mmWave Transmitarray Antenna Based on Life Cycle Assessment. EuCNC (2022)
Yann Beilliard, Stéphane Moreau, Léa Di Cioccio, Perceval Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix
direct hybrid bonding. 3DIC (2014)
Mariam Sadaka, Ionut Radu, Chrystelle Lagahe-Blanchard, Léa Di Cioccio
Smart Stacking™ and Smart Cut™ technologies for wafer level 3D integration. ICICDT (2013)
Ionut Radu, Gweltaz Gaudin, William van den Daele, Fabrice Letertre, Carlos Mazure, Léa Di Cioccio, Thomas Lacave, Frederic Mazen, Pascal Scheiblin, Thomas Signamarcheix, Sorin Cristoloveanu
Novel low temperature 3D wafer stacking technology for high density device integration. ESSDERC (2013)
Yann Beilliard, Perceval Coudrain, Léa Di Cioccio, Stéphane Moreau, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry
Chip to wafer copper direct bonding electrical characterization and thermal cycling. 3DIC (2013)
H. Moriceau, F. Rieutord, F. Fournel, Léa Di Cioccio, C. Moulet, Luc Libralesso, Pierric Gueguen, Rachid Taibi, C. Deguet
Low temperature direct bonding: An attractive technique for heterostructures build-up. Microelectron. Reliab. 52 (2) (2012)
S. Mermoz, Loic Sanchez, Léa Di Cioccio, J. Berthier, E. Deloffre, C. Fretigny
Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield. 3DIC (2011)
Léa Di Cioccio, Rachid Taibi, Cédrick Chappaz, Stéphane Moreau, Laurent-Luc Chapelon, Thomas Signamarcheix
200°C direct bonding copper interconnects : Electrical results and reliability. 3DIC (2011)
Ionut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, Fabrice Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka
Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. 3DIC (2010)
Léa Di Cioccio, Pierric Gueguen, Rachid Taibi, Thomas Signamarcheix, Laurent Bally, Laurent Vandroux, Marc Zussy, Sophie Verrun, Jérôme Dechamp, Patrick Leduc, Myriam Assous, David Bouchu, François de Crecy, Laurent-Luc Chapelon, Laurent Clavelier
An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling. 3DIC (2009)
Patrick Leduc, Myriam Assous, Léa Di Cioccio, Marc Zussy, Thomas Signamarcheix, Antonio Roman, Maxime Rousseau, Sophie Verrun, Laurent Bally, David Bouchu, Lionel Cadix, Alexis Farcy, Nicolas Sillon
First integration of Cu TSV using die-to-wafer direct bonding and planarization. 3DIC (2009)
Gilles Poupon, Nicolas Sillon, David Henry, Charlotte Gillot, Alan Mathewson, Léa Di Cioccio, Barbara Charlet, Patrick Leduc, Maud Vinet, Perrine Batude
System on Wafer: A New Silicon Concept in SiP. Proc. IEEE 97 (1) (2009)
Alberto Fazzi, Luca Magagni, Mauro Mirandola, Barbara Charlet, Léa Di Cioccio, Erik Jung, Roberto Canegallo, Roberto Guerrieri
3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly. IEEE J. Solid State Circuits 42 (10) (2007)
Roberto Canegallo, Alberto Fazzi, Luca Ciccarelli, Luca Magagni, Federico Natali, Pier Luigi Rolandi, Erik Jung, Léa Di Cioccio, Roberto Guerrieri
3D Capacitive Interconnections for High Speed Interchip Communication. CICC (2007)