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Low temperature direct bonding: An attractive technique for heterostructures build-up.
H. Moriceau
F. Rieutord
F. Fournel
Léa Di Cioccio
C. Moulet
Luc Libralesso
Pierric Gueguen
Rachid Taibi
C. Deguet
Published in:
Microelectron. Reliab. (2012)
Keyphrases
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pattern recognition
computational model
real time
three dimensional
signal processing