F. Fournel

Publication Activity (10 Years)

Years Active: 2012-2022
Publications (10 Years): 3

Top Topics

Spatial Resolution

Emerging Technologies

Multispectral Images

Top Venues

Publications

Walter Schwarzenbach, S. Rouchier, G. Berre, R. Boulet, O. Ledoux, E. Cela, A. Drouin, A. Chapelle, S. Monnoye, H. Biard, K. Alassaad, L. Viravaux, N. Ben Mohamed, D. Radisson, G. Picun, G. Lavaitte, A. Bouville-Lallart, J. Roi, J. Widiez, K. Abadie, E. Rolland, F. Fournel, G. Gélineau, F. Mazen, A. Moulin, C. Moulin, D. Delprat, N. Daval, S. Odoul, P. Sandri, C. Maleville
Engineered SiC materials for power technologies. ICICDT (2022)
C. Besancon, P. Fanneau, Delphine Néel, Giancarlo Cerulo, Nicolas Vaissiere, Dalila Make, Frédéric Pommereau, F. Fournel, C. Dupré, T. Baron, Jean Decobert
Laser Array Covering 155 nm Wide Spectral Band Achieved by Selective Area Growth on Silicon Wafer. ECOC (2020)
Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, V. Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. IRPS (2018)
H. Moriceau, F. Rieutord, F. Fournel, Léa Di Cioccio, C. Moulet, Luc Libralesso, Pierric Gueguen, Rachid Taibi, C. Deguet
Low temperature direct bonding: An attractive technique for heterostructures build-up. Microelectron. Reliab. 52 (2) (2012)