C. Euvrard

Publication Activity (10 Years)

Years Active: 2010-2018
Publications (10 Years): 1

Top Topics

Rapid Development

Multiresolution

Top Venues

Publications

Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, V. Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. IRPS (2018)
D. Le Cunff, A. Pravdivtsev, K. Le Chao, C. Euvrard, E. Deloffre, A. Cailean
Use of optical metrology for wafer level packaging of CMOS image sensor. 3DIC (2010)
Ionut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, Fabrice Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka
Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. 3DIC (2010)