Use of optical metrology for wafer level packaging of CMOS image sensor.

D. Le Cunff A. Pravdivtsev K. Le Chao C. Euvrard E. Deloffre A. Cailean

Published in: 3DIC (2010)

Keyphrases

cmos image sensor
high speed
solid state
sensor networks
processing capabilities
video sequences
image analysis
massively parallel