Login / Signup
Mariam Sadaka
Publication Activity (10 Years)
Years Active: 2010-2013
Publications (10 Years): 0
Top Topics
Enabling Technologies
Smart Environments
Ensemble Learning
Data Fusion
Top Venues
ICICDT
</>
Publications
</>
Mariam Sadaka
,
Ionut Radu
,
Chrystelle Lagahe-Blanchard
,
Léa Di Cioccio
Smart Stacking™ and Smart Cut™ technologies for wafer level 3D integration.
ICICDT
(2013)
Gregory Riou
,
Gweltaz Gaudin
,
Didier Landru
,
Catherine Tempesta
,
Ionut Radu
,
Mariam Sadaka
,
Kevin Winstel
,
Emily Kinser
,
Robert Hannon
,
Boris V. Kamenev
,
Michael Darwin
,
Robert Sachs
Pre bonding metrology solutions for 3D integration.
3DIC
(2010)
Gweltaz Gaudin
,
Gregory Riou
,
Didier Landru
,
Catherine Tempesta
,
Ionut Radu
,
Mariam Sadaka
,
Kevin Winstel
,
Emily Kinser
,
Robert Hannon
Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment.
3DIC
(2010)
Ionut Radu
,
Didier Landru
,
Gweltaz Gaudin
,
Gregory Riou
,
Catherine Tempesta
,
Fabrice Letertre
,
Léa Di Cioccio
,
Pierric Gueguen
,
Thomas Signamarcheix
,
C. Euvrard
,
Jérôme Dechamp
,
Laurent Clavelier
,
Mariam Sadaka
Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking.
3DIC
(2010)