Gweltaz Gaudin

Publication Activity (10 Years)

Years Active: 2010-2015
Publications (10 Years): 1

Top Topics

Rapid Development

Data Processing

Top Venues

Publications

Ionut Radu, Bich-Yen Nguyen, Gweltaz Gaudin, Carlos Mazure
3D monolithic integration: Stacking technology and applications. ICICDT (2015)
Ionut Radu, Gweltaz Gaudin, William van den Daele, Fabrice Letertre, Carlos Mazure, Léa Di Cioccio, Thomas Lacave, Frederic Mazen, Pascal Scheiblin, Thomas Signamarcheix, Sorin Cristoloveanu
Novel low temperature 3D wafer stacking technology for high density device integration. ESSDERC (2013)
Gregory Riou, Gweltaz Gaudin, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon, Boris V. Kamenev, Michael Darwin, Robert Sachs
Pre bonding metrology solutions for 3D integration. 3DIC (2010)
Gweltaz Gaudin, Gregory Riou, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon
Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment. 3DIC (2010)
Ionut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, Fabrice Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka
Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. 3DIC (2010)