Bich-Yen Nguyen

Publication Activity (10 Years)

Years Active: 2005-2023
Publications (10 Years): 7

Top Topics

Cmos Technology

Technological Advances

Top Venues

VLSI Technology and Circuits

Publications

Zuopu Zhou, Leming Jiao, Qiwen Kong, Zijie Zheng, Kaizhen Han, Yue Chen, Chen Sun, Bich-Yen Nguyen, Xiao Gong
High-Density Integration. VLSI Technology and Circuits (2023)
Guillaume Besnard, Bich-Yen Nguyen, Christophe Maleville
technology: from Substrate Enginnering to Advanced 3D Integration. ICICDT (2022)
Walter Schwarzenbach, L. Loubriat, Vincent Joseph, Laurent Viravaux, Olivier Moreau, Sebastien Lasserre, Bich-Yen Nguyen
22FD-SOI Variability Improvement Thanks to SmartCut Thickness Control at Atomic Scale. ESSDERC (2019)
Yiming Qu, Ran Cheng, Wei Liu, Junkang Li, Bich-Yen Nguyen, Olivier Faynot, Nuo Xu, Bing Chen, Yi Zhao
Effect of measurement speed (μs-800 ps) on the characterization of reliability behaviors for FDSOI nMOSFETs. IRPS (2018)
Walter Schwarzenbach, Manuel Sellier, Bich-Yen Nguyen, Christophe Girard, Christophe Maleville
FD-SOI material enabling CMOS technology disruption from 65nm to 12nm and beyond. ICICDT (2017)
Eunah Ko, Jaesung Jo, Changhwan Shin, Bich-Yen Nguyen
Layout engineering to suppress hysteresis of negative capacitance FinFET. ICICDT (2017)
Ionut Radu, Bich-Yen Nguyen, Gweltaz Gaudin, Carlos Mazure
3D monolithic integration: Stacking technology and applications. ICICDT (2015)
Carlos Mazure, Richard Ferrant, Bich-Yen Nguyen, Walter Schwarzenbach, Cécile Moulin
FDSOI: From substrate to devices and circuit applications. ESSCIRC (2010)
Borivoje Nikolic, Changhwan Shin, Min Hee Cho, Xin Sun, Tsu-Jae King Liu, Bich-Yen Nguyen
SRAM design in fully-depleted SOI technology. ISCAS (2010)
Olivier Thomas, Jean-Philippe Noel, Claire Fenouillet-Béranger, Marie-Anne Jaud, J. Dura, P. Perreau, Frédéric Boeuf, François Andrieu, D. Delprat, F. Boedt, Konstantin Bourdelle, Bich-Yen Nguyen, Andrei Vladimirescu, Amara Amara
32nm and beyond Multi-VT Ultra-Thin Body and BOX FDSOI: From device to circuit. ISCAS (2010)
Claire Fenouillet-Béranger, P. Perreau, S. Denorme, L. Tosti, François Andrieu, Olivier Weber, S. Barnola, C. Arvet, Y. Campidelli, Sébastien Haendler, R. Beneyton, C. Perrot, C. de Buttet, P. Gros, L. Pham-Nguyen, F. Leverd, P. Gouraud, F. Abbate, F. Baron, A. Torres, C. Laviron, L. Pinzelli, J. Vetier, C. Borowiak, A. Margain, D. Delprat, F. Boedt, Konstantin Bourdelle, Bich-Yen Nguyen, Olivier Faynot, Thomas Skotnicki
Impact of a 10nm Ultra-Thin BOX (UTBOX) and Ground Plane on FDSOI devices for 32nm node and below. ESSCIRC (2009)
Vishal P. Trivedi, Jerry G. Fossum, Leo Mathew, Murshed M. Chowdhury, Weimin Zhang, Glenn O. Workman, Bich-Yen Nguyen
Physics-based compact modeling for nonclassical CMOS. ICCAD (2005)