Ionut Radu

Publication Activity (10 Years)

Years Active: 2010-2022
Publications (10 Years): 1

Top Topics

Enabling Technologies

Quantum Computing

Top Venues

Publications

Fabio Bersano, Franco De Palma, Fabian Oppliger, Floris Braakman, Ionut Radu, Pasquale Scarlino, Martino Poggio, Adrian Mihai Ionescu
Multi-Gate FD-SOI Single Electron Transistor for hybrid SET-MOSFET quantum computing. ESSCIRC (2022)
Ionut Radu, Bich-Yen Nguyen, Gweltaz Gaudin, Carlos Mazure
3D monolithic integration: Stacking technology and applications. ICICDT (2015)
Mariam Sadaka, Ionut Radu, Chrystelle Lagahe-Blanchard, Léa Di Cioccio
Smart Stacking™ and Smart Cut™ technologies for wafer level 3D integration. ICICDT (2013)
Ionut Radu, Gweltaz Gaudin, William van den Daele, Fabrice Letertre, Carlos Mazure, Léa Di Cioccio, Thomas Lacave, Frederic Mazen, Pascal Scheiblin, Thomas Signamarcheix, Sorin Cristoloveanu
Novel low temperature 3D wafer stacking technology for high density device integration. ESSDERC (2013)
Gregory Riou, Gweltaz Gaudin, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon, Boris V. Kamenev, Michael Darwin, Robert Sachs
Pre bonding metrology solutions for 3D integration. 3DIC (2010)
Gweltaz Gaudin, Gregory Riou, Didier Landru, Catherine Tempesta, Ionut Radu, Mariam Sadaka, Kevin Winstel, Emily Kinser, Robert Hannon
Low temperature direct wafer to wafer bonding for 3D integration: Direct bonding, surface preparation, wafer-to-wafer alignment. 3DIC (2010)
Ionut Radu, Didier Landru, Gweltaz Gaudin, Gregory Riou, Catherine Tempesta, Fabrice Letertre, Léa Di Cioccio, Pierric Gueguen, Thomas Signamarcheix, C. Euvrard, Jérôme Dechamp, Laurent Clavelier, Mariam Sadaka
Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking. 3DIC (2010)