Novel low temperature 3D wafer stacking technology for high density device integration.

Ionut Radu Gweltaz Gaudin William van den Daele Fabrice Letertre Carlos Mazure Léa Di Cioccio Thomas Lacave Frederic Mazen Pascal Scheiblin Thomas Signamarcheix Sorin Cristoloveanu

Published in: ESSDERC (2013)

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