Recent Developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking.
Ionut RaduDidier LandruGweltaz GaudinGregory RiouCatherine TempestaFabrice LetertreLéa Di CioccioPierric GueguenThomas SignamarcheixC. EuvrardJérôme DechampLaurent ClavelierMariam SadakaPublished in: 3DIC (2010)