S. Lhostis

Publication Activity (10 Years)

Years Active: 2005-2023
Publications (10 Years): 4

Top Topics

Recent Advances

Top Venues

Publications

Stéphane Moreau, David Bouchu, J. Jourdon, Bassel Ayoub, S. Lhostis, Hélène Frémont, P. Lamontagne
Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits. IRPS (2023)
B. Ayoub, Stéphane Moreau, S. Lhostis, P. Lamontagne, H. Combeau, J. G. Mattei, H. Frémont
New Method to Perform TDDB Tests for Hybrid Bonding Interconnects. IRPS (2022)
Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, V. Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability. IRPS (2018)
Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau, Karim Azizi-Mourier, C. Chantre, Pascal Vivet, Gaël Pillonnet, F. Casset, F. Ponthenier, Alexis Farcy, S. Lhostis, Jean Michailos, Alexandre Arriordaz, Séverine Cheramy
ITAC: A complete 3D integration test platform. 3DIC (2016)
A. Sibai, S. Lhostis, Y. Rozier, O. Salicio, S. Amtablian, C. Dubois, J. Legrand, J. P. Sénateur, M. Audier, L. Hubert-Pfalzgraff
/Si(100). Microelectron. Reliab. 45 (5-6) (2005)