Hélène Frémont

Publication Activity (10 Years)

Years Active: 2004-2023
Publications (10 Years): 10

Top Topics

Mechanical Properties

Integrated Circuit

Top Venues

Microelectron. Reliab.

Publications

Stéphane Moreau, David Bouchu, J. Jourdon, Bassel Ayoub, S. Lhostis, Hélène Frémont, P. Lamontagne
Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits. IRPS (2023)
Quentin Vandier, Julien Pezard, Hélène Frémont, Éric Duchesne, Dominique Drouin
Readout Circuit Implemented on PCB-Level for Embedded CNT Sensors. I2MTC (2020)
Aurore Quelennec, Éric Duchesne, Hélène Frémont, Dominique Drouin
Source Separation Using Sensor's Frequency Response: Theory and Practice on Carbon Nanotubes Sensors. Sensors 19 (15) (2019)
S. Pin, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Frémont
Creep measurement and choice of creep laws for BGA assemblies' reliability simulation. Microelectron. Reliab. (2018)
Faical Arabi, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Frémont
Sequential combined thermal cycling and vibration test and simulation of printed circuit board. Microelectron. Reliab. (2018)
S. Hairoud-Airieau, Geneviève Duchamp, Tristan Dubois, Jean-Yves Delétage, André Durier, Hélène Frémont
Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach. Microelectron. Reliab. (2017)
Wissam Sabbah, Pierre Bondue, Oriol Avino-Salvado, Cyril Buttay, Hélène Frémont, Alexandrine Guédon-Gracia, Hervé Morel
High temperature ageing of microelectronics assemblies with SAC solder joints. Microelectron. Reliab. (2017)
Nathalie Labat, François Marc, Hélène Frémont, Marise Bafleur
Proceedings of the 28th European Symposium on the reliability of electron devices, failure physics and analysis. Microelectron. Reliab. (2017)
S. Pin, Hélène Frémont, Alexandrine Guédon-Gracia
Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations. Microelectron. Reliab. (2017)
Alexandrine Guédon-Gracia, Hélène Frémont, Bernard Plano, Jean-Yves Delétage, Kirsten Weide-Zaage
Effects of salt spray test on lead-free solder alloy. Microelectron. Reliab. 64 (2016)
André Durier, A. Bensoussan, Moustafa Zerarka, C. Ghfiri, A. Boyer, Hélène Frémont
A methodologic project to characterize and model COTS component reliability. Microelectron. Reliab. 55 (9-10) (2015)
Samed Barnat, Alexandrine Guédon-Gracia, Hélène Frémont
Virtual prototyping in a Design-for-Reliability approach. Microelectron. Reliab. 55 (9-10) (2015)
Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano
bumps. Microelectron. Reliab. 55 (1) (2015)
Marise Bafleur, Philippe Perdu, François Marc, Hélène Frémont, Nicolas Nolhier
Editorial. Microelectron. Reliab. 55 (9-10) (2015)
Tristan Dubois, Siham Hairoud, Marcio Hermany Gomes de Oliveira, Hélène Frémont, Geneviève Duchamp
Characterization and model of temperature effect on the conducted immunity of Op-Amp. Microelectron. Reliab. 55 (9-10) (2015)
Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont
Dynamical IMC-growth calculation. Microelectron. Reliab. 55 (9-10) (2015)
Hélène Frémont, Jörg Kludt, Massar Wade, Kirsten Weide-Zaage, Isabelle Bord-Majek, Geneviève Duchamp
Qualification procedure for moisture in embedded capacitors. Microelectron. Reliab. 54 (9-10) (2014)
J. B. Jullien, Hélène Frémont, Jean-Yves Delétage
Conductive adhesive joint for extreme temperature applications. Microelectron. Reliab. 53 (9-11) (2013)
Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano
solder joints on nickel gold pads. Microelectron. Reliab. 53 (9-11) (2013)
W. Ben Naceur, Nathalie Malbert, Nathalie Labat, Hélène Frémont, D. Carisetti, J. C. Clement, J. L. Muraro, Barbara Bonnet
Failure analysis of GaAs microwave devices with plastic encapsulation by electro-optical techniques. Microelectron. Reliab. 53 (9-11) (2013)
Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont
Electro- and thermo-migration induced failure mechanisms in Package on Package. Microelectron. Reliab. 52 (12) (2012)
Jean-Marc Thiriet, Hamed Yahoui, Hélène Frémont
International dimension to increase Lifelong Learning possibilities in Europe. ITHET (2012)
Samed Barnat, Hélène Frémont, Alexandrine Guédon-Gracia, Eric Cadalen
Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength. Microelectron. Reliab. 52 (9-10) (2012)
Jean-Baptiste Jullien, Bernard Plano, Hélène Frémont
Pushing toward the limits of acceleration: Example on wire-bond assemblies. Microelectron. Reliab. 52 (9-10) (2012)
Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage
Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers. Microelectron. Reliab. 52 (9-10) (2012)
Hélène Frémont, Geneviève Duchamp, Alexandrine Guédon-Gracia, Frédéric Verdier
A methodological approach for predictive reliability: Practical case studies. Microelectron. Reliab. 52 (12) (2012)
Olivier Bonnaud, Hélène Frémont, Jean-Marc Thiriet, Hamed Yahoui
PhD in Electrical and Information Engineering in Europe: Towards a harmonization including LifeLong Learning. ITHET (2012)
A. Aubert, Sébastien Jacques, S. Pétremont, Nathalie Labat, Hélène Frémont
Experimental power cycling on insulated TRIAC package: Reliability interpretation thanks to an innovative failure analysis flow. Microelectron. Reliab. 51 (9-11) (2011)
Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont
Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps. Microelectron. Reliab. 51 (9-11) (2011)
Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont
A fast moisture sensitivity level qualification method. Microelectron. Reliab. 50 (9-11) (2010)
Pascal Lecuyer, Hélène Frémont, Jean-Pierre Landesman, Manoubi Auguste Bahi
Wearout estimation using the Robustness Validation methodology for components in 150 degreeC ambient automotive applications. Microelectron. Reliab. 50 (9-11) (2010)
A. Aubert, J. P. Rebrasse, Lionel Dantas de Morais, Nathalie Labat, Hélène Frémont
Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing. Microelectron. Reliab. 50 (9-11) (2010)
Charles Regard, Christian Gautier, Hélène Frémont, Patrick Poirier, Xiaosong Ma, Kaspar M. B. Jansen
Fast reliability qualification of SiP products. Microelectron. Reliab. 49 (9-11) (2009)
Maxime Berthou, P. Retailleau, Hélène Frémont, Alexandrine Guédon-Gracia, C. Jéphos-Davennel
Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage. Microelectron. Reliab. 49 (9-11) (2009)
Manoubi Auguste Bahi, Hélène Frémont, Jean-Pierre Landesman, Annabelle Gentil, Pascal Lecuyer
A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages. Microelectron. Reliab. 49 (9-11) (2009)
Manoubi Auguste Bahi, Pascal Lecuyer, Hélène Frémont, Jean-Pierre Landesman
Sequential environmental stresses tests qualification for automotive components. Microelectron. Reliab. 47 (9-11) (2007)
W. C. Maia Filho, M. Brizoux, Hélène Frémont, Yves Danto
Torsion test applied for reballing and solder paste volume evaluation. Microelectron. Reliab. 47 (9-11) (2007)
Kirsten Weide-Zaage, David Dalleau, Yves Danto, Hélène Frémont
Dynamic void formation in a DD-copper-structure with different metallization geometry. Microelectron. Reliab. 47 (2-3) (2007)
W. C. Maia Filho, M. Brizoux, Hélène Frémont, Yves Danto
Improved physical understanding of intermittent failure in continuous monitoring method. Microelectron. Reliab. 46 (9-11) (2006)
Kirsten Weide-Zaage, Walter Horaud, Hélène Frémont
Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations. Microelectron. Reliab. 45 (9-11) (2005)
Hélène Frémont, Jean-Yves Delétage, Kirsten Weide-Zaage, Yves Danto
How to study delamination in plastic encapsulated devices. Microelectron. Reliab. 44 (9-11) (2004)