Kaspar M. B. Jansen

Publication Activity (10 Years)

Years Active: 2007-2024
Publications (10 Years): 9

Top Topics

Depth From Focus

Activity Recognition

Spatial Configuration

Top Venues

Microelectron. Reliab.

UbiComp/ISWC Adjunct

Publications

Qiang Liu, Sepideh Ghodrat, Kaspar M. B. Jansen
Mimosa: Modular Self-folding Hinges Kit for Creating Shape-changing Objects. TEI (2024)
Beyza Bozali, Sepideh Ghodrat, Linda Plaude, Joris J. F. van Dam, Kaspar M. B. Jansen
Development of Low Hysteresis, Linear Weft-Knitted Strain Sensors for Smart Textile Applications. Sensors 22 (19) (2022)
Rafael Cuperman, Kaspar M. B. Jansen, Michal G. Ciszewski
An End-to-End Deep Learning Pipeline for Football Activity Recognition Based on Wearable Acceleration Sensors. Sensors 22 (4) (2022)
Beyza Bozali, J. J. F. van Dam, Linda Plaude, Kaspar M. B. Jansen
Development of hysteresis-free and linear knitted strain sensors for smart textile applications. IEEE SENSORS (2021)
Kaspar M. B. Jansen
Performance Evaluation of Knitted and Stitched Textile Strain Sensors. Sensors 20 (24) (2020)
Annemarijn S. M. Steijlen, Jeroen Bastemeijer, Kaspar M. B. Jansen, Patrick J. French, Andre Bossche
A novel sweat rate and conductivity sensor patch made with low-cost fabrication techniques. IEEE SENSORS (2020)
Annemarijn S. M. Steijlen, Jeroen Bastemeijer, W. A. Groen, Kaspar M. B. Jansen, Pim J. French, Andre Bossche
Development of a microfluidic collection system to measure electrolyte variations in sweat during exercise. EMBC (2020)
Kaspar M. B. Jansen
How to shape the future of smart clothing. UbiComp/ISWC Adjunct (2019)
A. R. Rezaie Adli, Kaspar M. B. Jansen
Numerical investigation and experimental validation of residual stresses building up in microelectronics packaging. Microelectron. Reliab. 62 (2016)
M. Yazdan Mehr, W. D. van Driel, Kaspar M. B. Jansen, P. Deeben, G. Q. Zhang
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products. Microelectron. Reliab. 54 (1) (2014)
M. Sadeghinia, Kaspar M. B. Jansen, Leo J. Ernst
Characterization of the viscoelastic properties of an epoxy molding compound during cure. Microelectron. Reliab. 52 (8) (2012)
J. de Vreugd, Kaspar M. B. Jansen, Leo J. Ernst, C. Bohm
Prediction of cure induced warpage of micro-electronic products. Microelectron. Reliab. 50 (7) (2010)
Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont
A fast moisture sensitivity level qualification method. Microelectron. Reliab. 50 (9-11) (2010)
Charles Regard, Christian Gautier, Hélène Frémont, Patrick Poirier, Xiaosong Ma, Kaspar M. B. Jansen
Fast reliability qualification of SiP products. Microelectron. Reliab. 49 (9-11) (2009)
Kaspar M. B. Jansen, C. Qian, Leo J. Ernst, C. Bohm, A. Kessler, Harald Preu, Matthias Stecher
Modeling and characterization of molding compound properties during cure. Microelectron. Reliab. 49 (8) (2009)
Tomasz Falat, Artur Wymyslowski, Jana Kolbe, Kaspar M. B. Jansen, Leo J. Ernst
Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach. Microelectron. Reliab. 47 (12) (2007)
H. J. L. Bressers, W. D. van Driel, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang
Correlation between chemistry of polymer building blocks and microelectronics reliability. Microelectron. Reliab. 47 (2-3) (2007)
C. van't Hof, Kaspar M. B. Jansen, G. Wisse, Leo J. Ernst, Dao-Guo Yang, G. Q. Zhang, H. J. L. Bressers
Novel shear tools for viscoelastic characterization of packaging polymers. Microelectron. Reliab. 47 (2-3) (2007)
Xiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis, G. Q. Zhang
Characterization of moisture properties of polymers for IC packaging. Microelectron. Reliab. 47 (9-11) (2007)
M. van Soestbergen, Leo J. Ernst, Kaspar M. B. Jansen, W. D. van Driel
Measuring the through-plane elastic modulus of thin polymer films in situ. Microelectron. Reliab. 47 (12) (2007)
Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen
Numerical modeling of warpage induced in QFN array molding process. Microelectron. Reliab. 47 (2-3) (2007)
Viktor Gonda, Kaspar M. B. Jansen, Leo J. Ernst, Jaap M. J. den Toonder, G. Q. Zhang
Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques. Microelectron. Reliab. 47 (2-3) (2007)
Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. Microelectron. Reliab. 47 (2-3) (2007)