G. Q. Zhang

Publication Activity (10 Years)

Years Active: 2003-2020
Publications (10 Years): 10

Top Topics

Carbon Nanotubes

Top Venues

Microelectron. Reliab.

Reliab. Eng. Syst. Saf.

Publications

Luke M. Middelburg, Mohammadamir Ghaderi, David Bilby, Jacobus H. Visser, G. Q. Zhang, Reinoud F. Wolffenbuttel
Impedance Spectroscopy for Enhanced Data Collection of Conductometric Soot Sensors. ISIE (2020)
Y. Ye, Richard D. Boyce, M. K. Davis, K. Elliston, Christos Davatzikos, Andrey Fedorov, Jean-Christophe Fillion-Robin, Ian T. Foster, John R. Gilbertson, Mervi Heiskanen, Juli D. Klemm, Andras Lasso, James V. Miller, M. Morgan, Steve Pieper, B. Raumann, B. Sarachan, G. Savova, Jonathan C. Silverstein, D. Taylor, J. Zelnis, G. Q. Zhang, Michael J. Becich
Open Source Software Sustainability Models: Initial White Paper from the Information Technology for Cancer Research Sustainability and Industry Partnership Work Group. CoRR (2019)
Robert Sokolovskij, J. Zhang, H. Zheng, W. Li, Yang Jiang, G. Yang, Hongyu Yu, Pasqualina M. Sarro, G. Q. Zhang
Recessed gate Pt-AlGaN/GaN HEMT H2 sensor. IEEE SENSORS (2019)
Luke M. Middelburg, Brahim El Mansouri, René Poelma, G. Q. Zhang, Henk W. van Zeijl, Jia Wei
Non-Linear Bulk Micromachined Accelerometer for High Sensitivity Applications. IEEE SENSORS (2018)
M. Yazdan Mehr, M. R. Toroghinejad, F. Karimzadeh, W. D. van Driel, G. Q. Zhang
A review on discoloration and high accelerated testing of optical materials in LED based-products. Microelectron. Reliab. 81 (2018)
Guangjun Lu, W. D. van Driel, Xuejun Fan, Jiajie Fan, Cheng Qian, G. Q. Zhang
Color shift acceleration on mid-power LED packages. Microelectron. Reliab. 78 (2017)
M. Yazdan Mehr, M. R. Toroghinejad, F. Karimzadeh, W. D. van Driel, G. Q. Zhang
Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products. Microelectron. Reliab. 78 (2017)
Luke M. Middelburg, Brahim El Mansouri, Henk W. van Zeijl, G. Q. Zhang, R. H. Poelma
High aspect ratio spiral resonators for process variation investigation and MEMS applications. IEEE SENSORS (2017)
Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang
Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test. Reliab. Eng. Syst. Saf. 154 (2016)
Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang
Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests. Microelectron. Reliab. 55 (12) (2015)
S. Tarashioon, W. D. van Driel, G. Q. Zhang
Multi-physics reliability simulation for solid state lighting drivers. Microelectron. Reliab. 54 (6-7) (2014)
Z. Kolahdouz Esfahani, T. Ma, Henk W. van Zeijl, G. Q. Zhang, A. Rostamian, Mohammadreza Kolahdouz
Blue selective photodiodes for optical feedback in LED wafer level packages. ESSDERC (2014)
M. Yazdan Mehr, Willem D. van Driel, G. Q. Zhang
Accelerated life time testing and optical degradation of remote phosphor plates. Microelectron. Reliab. 54 (8) (2014)
M. Yazdan Mehr, W. D. van Driel, Kaspar M. B. Jansen, P. Deeben, G. Q. Zhang
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products. Microelectron. Reliab. 54 (1) (2014)
Miao Cai, D. J. Xie, W. B. Chen, B. Y. Wu, Dao-Guo Yang, G. Q. Zhang
A novel soldering method to evaluate PCB pad cratering for pin-pull testing. Microelectron. Reliab. 53 (9-11) (2013)
F. Santagata, G. Almanno, Sten Vollebregt, C. Silvestri, G. Q. Zhang, Pasqualina M. Sarro
Carbon Nanotube based heat-sink for solid state lighting. NEMS (2013)
Joseph Teagno, Richard C. Kiefer, Jyotishman Pathak, G. Q. Zhang, Satya Sanket Sahoo
A Distributed Semantic Web Approach for Cohort Identification. AMIA (2012)
R. H. Poelma, H. Sadeghian, Sau Koh, G. Q. Zhang
Effects of single vacancy defect position on the stability of carbon nanotubes. Microelectron. Reliab. 52 (7) (2012)
S. Tarashioon, Alessandro Baiano, Henk W. van Zeijl, C. Guo, S. W. Koh, W. D. van Driel, G. Q. Zhang
An approach to "Design for Reliability" in solid state lighting systems at high temperatures. Microelectron. Reliab. 52 (5) (2012)
Jeroen J. M. Zaal, Willem D. van Driel, G. Q. Zhang
Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices. Sensors 10 (4) (2010)
Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont
A fast moisture sensitivity level qualification method. Microelectron. Reliab. 50 (9-11) (2010)
Jeroen J. M. Zaal, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang
Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull. Microelectron. Reliab. 49 (8) (2009)
S. P. M. Noijen, Olaf van der Sluis, P. H. M. Timmermans, G. Q. Zhang
Numerical prediction of failure paths at a roughened metal/polymer interface. Microelectron. Reliab. 49 (9-11) (2009)
Y. Liu, F. J. H. G. Kessels, Willem D. van Driel, J. A. S. van Driel, F. L. Sun, G. Q. Zhang
Comparing drop impact test method using strain gauge measurements. Microelectron. Reliab. 49 (9-11) (2009)
Olaf van der Sluis, R. A. B. Engelen, P. H. M. Timmermans, G. Q. Zhang
Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics. Microelectron. Reliab. 49 (8) (2009)
W. D. van Driel, Dao-Guo Yang, G. Q. Zhang
On chip-package stress interaction. Microelectron. Reliab. 48 (8-9) (2008)
Q. Li, J. F. L. Goosen, J. T. M. van Beek, Fred van Keulen, K. L. Phan, G. Q. Zhang
Failure analysis of a thin-film nitride MEMS package. Microelectron. Reliab. 48 (8-9) (2008)
Jeroen J. M. Zaal, W. D. van Driel, S. Bendida, Q. Li, J. T. M. van Beek, G. Q. Zhang
Packaging influences on the reliability of MEMS resonators. Microelectron. Reliab. 48 (8-9) (2008)
W. D. van Driel, A. Mavinkurve, M. A. J. van Gils, G. Q. Zhang
Advanced structural similarity rules for the BGA package family. Microelectron. Reliab. 47 (2-3) (2007)
H. J. L. Bressers, W. D. van Driel, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang
Correlation between chemistry of polymer building blocks and microelectronics reliability. Microelectron. Reliab. 47 (2-3) (2007)
C. van't Hof, Kaspar M. B. Jansen, G. Wisse, Leo J. Ernst, Dao-Guo Yang, G. Q. Zhang, H. J. L. Bressers
Novel shear tools for viscoelastic characterization of packaging polymers. Microelectron. Reliab. 47 (2-3) (2007)
M. A. J. van Gils, Olaf van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken
Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectron. Reliab. 47 (2-3) (2007)
Xiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis, G. Q. Zhang
Characterization of moisture properties of polymers for IC packaging. Microelectron. Reliab. 47 (9-11) (2007)
Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen
Numerical modeling of warpage induced in QFN array molding process. Microelectron. Reliab. 47 (2-3) (2007)
Artur Wymyslowski, W. D. van Driel, J. van de Peer, N. Tzannetakis, G. Q. Zhang
Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability. Microelectron. Reliab. 47 (2-3) (2007)
Viktor Gonda, Kaspar M. B. Jansen, Leo J. Ernst, Jaap M. J. den Toonder, G. Q. Zhang
Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques. Microelectron. Reliab. 47 (2-3) (2007)
M. A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen
Virtual qualification of moisture induced failures of advanced packages. Microelectron. Reliab. 47 (2-3) (2007)
Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. Microelectron. Reliab. 47 (2-3) (2007)
R. L. J. M. Ubachs, Olaf van der Sluis, W. D. van Driel, G. Q. Zhang
Multiscale modelling of multilayer substrates. Microelectron. Reliab. 46 (9-11) (2006)
Cadmus A. Yuan, Willem D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, Roy A. B. Engelen, Leo J. Ernst, Fred van Keulen, G. Q. Zhang
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectron. Reliab. 46 (9-11) (2006)
W. D. van Driel, Olaf van der Sluis, Dao-Guo Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang
Reliability modelling for packages in flexible end-products. Microelectron. Reliab. 46 (9-11) (2006)
G. Q. Zhang, K. K. Lai
Combining path relinking and genetic algorithms for the multiple-level warehouse layout problem. Eur. J. Oper. Res. 169 (2) (2006)
A. J. van Roosmalen, G. Q. Zhang
Reliability challenges in the nanoelectronics era. Microelectron. Reliab. 46 (9-11) (2006)
W. D. van Driel, M. A. J. van Gils, Richard B. R. van Silfhout, G. Q. Zhang
Prediction of Delamination Related IC & Packaging Reliability Problems. Microelectron. Reliab. 45 (9-11) (2005)
Willem D. van Driel, C. J. Liu, G. Q. Zhang, J. H. J. Janssen, Richard B. R. van Silfhout, M. A. J. van Gils, Leo J. Ernst
Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. Microelectron. Reliab. 44 (12) (2004)
Y. T. He, M. A. J. van Gils, Willem D. van Driel, G. Q. Zhang, Richard B. R. van Silfhout, Leo J. Ernst
Prediction of crack growth in IC passivation layers. Microelectron. Reliab. 44 (12) (2004)
Müge Erinc, Piet J. G. Schreurs, G. Q. Zhang, Marc G. D. Geers
Characterization and fatigue damage simulation in SAC solder joints. Microelectron. Reliab. 44 (9-11) (2004)
Viktor Gonda, Jaap M. J. den Toonder, Johan Beijer, G. Q. Zhang, Willem D. van Driel, Romano J. O. M. Hoofman, Leo J. Ernst
Prediction of thermo-mechanical integrity of wafer backend processes. Microelectron. Reliab. 44 (12) (2004)
M. A. J. van Gils, P. J. J. H. A. Habets, G. Q. Zhang, Willem D. van Driel, Piet J. G. Schreurs
Characterization and Modelling of Moisture Driven Interface Failures. Microelectron. Reliab. 44 (9-11) (2004)
Xuejun Fan, J. Zhou, G. Q. Zhang
Multi-physics modeling in virtual prototyping of electronic packages--combined thermal, thermo-mechanical and vapor pressure modeling. Microelectron. Reliab. 44 (12) (2004)
G. Q. Zhang, Jaap Bisschop
Integrated thermo-mechanical design and qualification of wafer backend structures. Microelectron. Reliab. 44 (9-11) (2004)
Dao-Guo Yang, J. S. Liang, Quan-Yong Li, Leo J. Ernst, G. Q. Zhang
Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach. Microelectron. Reliab. 44 (12) (2004)
W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi
Prediction and verification of process induced warpage of electronic packages. Microelectron. Reliab. 43 (5) (2003)
G. Q. Zhang
The challenges of virtual prototyping and qualification for future microelectronics. Microelectron. Reliab. 43 (9-11) (2003)