Hendrik Pieter Hochstenbach

Publication Activity (10 Years)

Years Active: 2008-2010
Publications (10 Years): 0

Publications

Hendrik Pieter Hochstenbach, Willem D. van Driel, Dao-Guo Yang, Jeroen J. M. Zaal, E. Bagerman
Designing for reliability using a new Wafer Level Package structure. Microelectron. Reliab. 50 (4) (2010)
Jeroen J. M. Zaal, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang
Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull. Microelectron. Reliab. 49 (8) (2009)
Fenglian Sun, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. (Kouchi) Zhang
Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP. Microelectron. Reliab. 48 (8-9) (2008)