Willem D. van Driel

Publication Activity (10 Years)

Years Active: 2004-2024
Publications (10 Years): 9

Top Topics

High Temperature

Stochastic Process

Light Emitting Diodes

Industrial Applications

Top Venues

Reliab. Eng. Syst. Saf.

Microelectron. Reliab.

Publications

Roberto Rocchetta, Zhouzhao Zhan, Willem D. van Driel, Alessandro Di Bucchianico
Uncertainty analysis and interval prediction of LEDs lifetimes. Reliab. Eng. Syst. Saf. 242 (2024)
Alexander Herzog, Simon Benkner, Babak Zandi, Matteo Buffolo, Willem D. van Driel, Matteo Meneghini, Tran Quoc Khanh
Lifetime Prediction of Current-and Temperature-Induced Degradation in Silicone-Encapsulated 365 nm High-Power Light-Emitting Diodes. IEEE Access 11 (2023)
Leonhard Faubel, Thomas Woudsma, Leila Methnani, Amir Ghorbani Ghezeljhemeidan, Fabian Bülow, Klaus Schmid, Willem D. van Driel, Benjamin Klöpper, Andreas Theodorou, Mohsen Nosratinia, Magnus Bång
Towards an MLOps Architecture for XAI in Industrial Applications. CoRR (2023)
Leiming Du, Xiujuan Zhao, Piet Watté, René Poelma, Willem D. van Driel, Guoqi Zhang
Investigation of Potting Compounds on Thermal-Fatigue properties of Solder Interconnects. IECON (2022)
Simon Benkner, Alexander Herzog, Stefan Klir, Willem D. van Driel, Tran Quoc Khanh
Advancements in Spectral Power Distribution Modeling of Light-Emitting Diodes. IEEE Access 10 (2022)
Klaus Pressel, Josef Moser, Sven Rzepka, Klas Brinkfeldt, Susan Zhao, Willem D. van Driel, Paolo Giammatteo, Baris Bulut, Mujdat Soyturk, Luigi Pomante
The H2020-ECSEL Project "iRel40" (Intelligent Reliability 4.0). DSD (2021)
Bo Sun, Xuejun Fan, Willem D. van Driel, Chengqiang Cui, Guoqi Zhang
A stochastic process based reliability prediction method for LED driver. Reliab. Eng. Syst. Saf. 178 (2018)
Bo Sun, Xuejun Fan, Huaiyu Ye, Jiajie Fan, Cheng Qian, Willem D. van Driel, Guoqi Zhang
A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation. Reliab. Eng. Syst. Saf. 163 (2017)
Werner Rom, Peter Priller, Jani Koivusaari, Maarjana Komi, Ramiro Robles, Luis Dominguez, Javier Rivilla, Willem D. van Driel
DEWI - Wirelessly into the Future. DSD (2015)
M. Yazdan Mehr, Willem D. van Driel, G. Q. Zhang
Accelerated life time testing and optical degradation of remote phosphor plates. Microelectron. Reliab. 54 (8) (2014)
M. Yazdan Mehr, Willem D. van Driel, Sau Koh, Guoqi Zhang
Reliability and optical properties of LED lens plates under high temperature stress. Microelectron. Reliab. 54 (11) (2014)
Jianfei Dong, Ashish Pandharipande, Willem D. van Driel, Guoqi Zhang
Diagnosing Lumen Depreciation in LED Lighting Systems: An Estimation Approach. IEEE Trans. Signal Process. 60 (7) (2012)
Rene Kregting, Sander Gielen, Willem D. van Driel, Paul Alkemade, Hozan Miro, Jan-Dirk Kamminga
Local stress analysis on semiconductor devices by combined experimental-numerical procedure. Microelectron. Reliab. 51 (6) (2011)
Dao-Guo Yang, F. F. Wan, Z. Y. Shou, Willem D. van Driel, H. Scholten, L. Goumans, Roberto Faria
Effect of high temperature aging on reliability of automotive electronics. Microelectron. Reliab. 51 (9-11) (2011)
Hendrik Pieter Hochstenbach, Willem D. van Driel, Dao-Guo Yang, Jeroen J. M. Zaal, E. Bagerman
Designing for reliability using a new Wafer Level Package structure. Microelectron. Reliab. 50 (4) (2010)
Jeroen J. M. Zaal, Willem D. van Driel, G. Q. Zhang
Challenges in the Assembly and Handling of Thin Film Capped MEMS Devices. Sensors 10 (4) (2010)
Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont
A fast moisture sensitivity level qualification method. Microelectron. Reliab. 50 (9-11) (2010)
Jeroen J. M. Zaal, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. Zhang
Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull. Microelectron. Reliab. 49 (8) (2009)
Y. Liu, F. J. H. G. Kessels, Willem D. van Driel, J. A. S. van Driel, F. L. Sun, G. Q. Zhang
Comparing drop impact test method using strain gauge measurements. Microelectron. Reliab. 49 (9-11) (2009)
J. de Vries, M. Jansen, Willem D. van Driel
Solder-joint reliability of HVQFN-packages subjected to thermal cycling. Microelectron. Reliab. 49 (3) (2009)
Cadmus A. Yuan, Olaf van der Sluis, Willem D. van Driel, G. Q. (Kouchi) Zhang
The need for multi-scale approaches in Cu/low-k reliability issues. Microelectron. Reliab. 48 (6) (2008)
Fenglian Sun, Hendrik Pieter Hochstenbach, Willem D. van Driel, G. Q. (Kouchi) Zhang
Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP. Microelectron. Reliab. 48 (8-9) (2008)
J. Thijsse, Olaf van der Sluis, J. A. W. van Dommelen, Willem D. van Driel, Marc G. D. Geers
Characterization of semiconductor interfaces using a modified mixed mode bending apparatus. Microelectron. Reliab. 48 (3) (2008)
Cadmus A. Yuan, Olaf van der Sluis, G. Q. (Kouchi) Zhang, Leo J. Ernst, Willem D. van Driel, Richard B. R. van Silfhout
Molecular simulation on the material/interfacial strength of the low-dielectric materials. Microelectron. Reliab. 47 (9-11) (2007)
Willem D. van Driel, Dao-Guo Yang, Cadmus A. Yuan, M. van Kleef, G. Q. (Kouchi) Zhang
Mechanical reliability challenges for MEMS packages: Capping. Microelectron. Reliab. 47 (9-11) (2007)
Cadmus A. Yuan, Willem D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, Roy A. B. Engelen, Leo J. Ernst, Fred van Keulen, G. Q. Zhang
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectron. Reliab. 46 (9-11) (2006)
Willem D. van Driel, C. J. Liu, G. Q. Zhang, J. H. J. Janssen, Richard B. R. van Silfhout, M. A. J. van Gils, Leo J. Ernst
Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. Microelectron. Reliab. 44 (12) (2004)
Y. T. He, M. A. J. van Gils, Willem D. van Driel, G. Q. Zhang, Richard B. R. van Silfhout, Leo J. Ernst
Prediction of crack growth in IC passivation layers. Microelectron. Reliab. 44 (12) (2004)
Viktor Gonda, Jaap M. J. den Toonder, Johan Beijer, G. Q. Zhang, Willem D. van Driel, Romano J. O. M. Hoofman, Leo J. Ernst
Prediction of thermo-mechanical integrity of wafer backend processes. Microelectron. Reliab. 44 (12) (2004)
M. A. J. van Gils, P. J. J. H. A. Habets, G. Q. Zhang, Willem D. van Driel, Piet J. G. Schreurs
Characterization and Modelling of Moisture Driven Interface Failures. Microelectron. Reliab. 44 (9-11) (2004)