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Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods.

Willem D. van DrielC. J. LiuG. Q. ZhangJ. H. J. JanssenRichard B. R. van SilfhoutM. A. J. van GilsLeo J. Ernst
Published in: Microelectron. Reliab. (2004)
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