Leo J. Ernst

Publication Activity (10 Years)

Years Active: 2003-2012
Publications (10 Years): 0

Top Topics

Information Technology

Top Venues

Microelectron. Reliab.

Publications

M. Sadeghinia, Kaspar M. B. Jansen, Leo J. Ernst
Characterization of the viscoelastic properties of an epoxy molding compound during cure. Microelectron. Reliab. 52 (8) (2012)
J. de Vreugd, Kaspar M. B. Jansen, Leo J. Ernst, C. Bohm
Prediction of cure induced warpage of micro-electronic products. Microelectron. Reliab. 50 (7) (2010)
Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont
A fast moisture sensitivity level qualification method. Microelectron. Reliab. 50 (9-11) (2010)
Kaspar M. B. Jansen, C. Qian, Leo J. Ernst, C. Bohm, A. Kessler, Harald Preu, Matthias Stecher
Modeling and characterization of molding compound properties during cure. Microelectron. Reliab. 49 (8) (2009)
Cadmus A. Yuan, Olaf van der Sluis, G. Q. (Kouchi) Zhang, Leo J. Ernst, Willem D. van Driel, Richard B. R. van Silfhout
Molecular simulation on the material/interfacial strength of the low-dielectric materials. Microelectron. Reliab. 47 (9-11) (2007)
Tomasz Falat, Artur Wymyslowski, Jana Kolbe, Kaspar M. B. Jansen, Leo J. Ernst
Influence of matrix viscoelastic properties on thermal conductivity of TCA - Numerical approach. Microelectron. Reliab. 47 (12) (2007)
H. J. L. Bressers, W. D. van Driel, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang
Correlation between chemistry of polymer building blocks and microelectronics reliability. Microelectron. Reliab. 47 (2-3) (2007)
C. van't Hof, Kaspar M. B. Jansen, G. Wisse, Leo J. Ernst, Dao-Guo Yang, G. Q. Zhang, H. J. L. Bressers
Novel shear tools for viscoelastic characterization of packaging polymers. Microelectron. Reliab. 47 (2-3) (2007)
Xiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis, G. Q. Zhang
Characterization of moisture properties of polymers for IC packaging. Microelectron. Reliab. 47 (9-11) (2007)
M. van Soestbergen, Leo J. Ernst, Kaspar M. B. Jansen, W. D. van Driel
Measuring the through-plane elastic modulus of thin polymer films in situ. Microelectron. Reliab. 47 (12) (2007)
Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen
Numerical modeling of warpage induced in QFN array molding process. Microelectron. Reliab. 47 (2-3) (2007)
Viktor Gonda, Kaspar M. B. Jansen, Leo J. Ernst, Jaap M. J. den Toonder, G. Q. Zhang
Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques. Microelectron. Reliab. 47 (2-3) (2007)
Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. Microelectron. Reliab. 47 (2-3) (2007)
Cadmus A. Yuan, Willem D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, Roy A. B. Engelen, Leo J. Ernst, Fred van Keulen, G. Q. Zhang
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectron. Reliab. 46 (9-11) (2006)
Willem D. van Driel, C. J. Liu, G. Q. Zhang, J. H. J. Janssen, Richard B. R. van Silfhout, M. A. J. van Gils, Leo J. Ernst
Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. Microelectron. Reliab. 44 (12) (2004)
Y. T. He, M. A. J. van Gils, Willem D. van Driel, G. Q. Zhang, Richard B. R. van Silfhout, Leo J. Ernst
Prediction of crack growth in IC passivation layers. Microelectron. Reliab. 44 (12) (2004)
Viktor Gonda, Jaap M. J. den Toonder, Johan Beijer, G. Q. Zhang, Willem D. van Driel, Romano J. O. M. Hoofman, Leo J. Ernst
Prediction of thermo-mechanical integrity of wafer backend processes. Microelectron. Reliab. 44 (12) (2004)
Dao-Guo Yang, J. S. Liang, Quan-Yong Li, Leo J. Ernst, G. Q. Zhang
Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach. Microelectron. Reliab. 44 (12) (2004)
W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi
Prediction and verification of process induced warpage of electronic packages. Microelectron. Reliab. 43 (5) (2003)