Cadmus A. Yuan

Publication Activity (10 Years)

Years Active: 2006-2016
Publications (10 Years): 2

Top Topics

Light Emitting Diodes

Programmable Logic

Physical Design

Top Venues

Microelectron. Reliab.

Reliab. Eng. Syst. Saf.

Publications

C. Qian, X. J. Fan, J. J. Fan, Cadmus A. Yuan, Guo Qi Zhang
An accelerated test method of luminous flux depreciation for LED luminaires and lamps. Reliab. Eng. Syst. Saf. 147 (2016)
Yang Liu, Fenglian Sun, Hao Zhang, Tong Xin, Cadmus A. Yuan, Guoqi Zhang
Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes. Microelectron. Reliab. 55 (8) (2015)
Huaiyu Ye, Bo Li, Hongyu Tang, Jia Zhao, Cadmus A. Yuan, Guoqi Zhang
Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes. Microelectron. Reliab. 54 (11) (2014)
Yang Liu, Stanley Y. Y. Leung, Jia Zhao, Cell K. Y. Wong, Cadmus A. Yuan, Guoqi Zhang, Fenglian Sun, Liangliang Luo
Thermal and mechanical effects of voids within flip chip soldering in LED packages. Microelectron. Reliab. 54 (9-10) (2014)
Cadmus A. Yuan, Olaf van der Sluis, Willem D. van Driel, G. Q. (Kouchi) Zhang
The need for multi-scale approaches in Cu/low-k reliability issues. Microelectron. Reliab. 48 (6) (2008)
Cadmus A. Yuan, Olaf van der Sluis, G. Q. (Kouchi) Zhang, Leo J. Ernst, Willem D. van Driel, Richard B. R. van Silfhout
Molecular simulation on the material/interfacial strength of the low-dielectric materials. Microelectron. Reliab. 47 (9-11) (2007)
Willem D. van Driel, Dao-Guo Yang, Cadmus A. Yuan, M. van Kleef, G. Q. (Kouchi) Zhang
Mechanical reliability challenges for MEMS packages: Capping. Microelectron. Reliab. 47 (9-11) (2007)
Cadmus A. Yuan, Willem D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, Roy A. B. Engelen, Leo J. Ernst, Fred van Keulen, G. Q. Zhang
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectron. Reliab. 46 (9-11) (2006)