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Mechanical reliability challenges for MEMS packages: Capping.
Willem D. van Driel
Dao-Guo Yang
Cadmus A. Yuan
M. van Kleef
G. Q. (Kouchi) Zhang
Published in:
Microelectron. Reliab. (2007)
Keyphrases
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lessons learned
key issues
technical challenges
multiresolution
open issues
real world
data sets
learning algorithm
artificial intelligence
knowledge base
application scenarios
highly reliable