Dao-Guo Yang

Publication Activity (10 Years)

Years Active: 2004-2024
Publications (10 Years): 15

Top Topics

High Temperature

Genetic Algorithm

Top Venues

Microelectron. Reliab.

Publications

Hengjian He, Miao Cai, Minghui Yun, Hao Chen, Huanhuan Wang, Dao-Guo Yang
Highly Stable Pin Pull Test Method for PCB Pad Cratering Characterization. IEEE Trans. Instrum. Meas. 73 (2024)
Dao-Guo Yang, Daoshuang Geng, Lixia Zheng, Miao Cai, Weidong Hao
Entropy-based analysis and classification of acute tonic pain from microwave transcranial signals obtained via the microwave-scattering approach. Biomed. Signal Process. Control. 65 (2021)
Daoshuang Geng, Dao-Guo Yang, Miao Cai, Lixia Zheng
A Novel Microwave Treatment for Sleep Disorders and Classification of Sleep Stages Using Multi-Scale Entropy. Entropy 22 (3) (2020)
Daoshuang Geng, Dao-Guo Yang, Miao Cai, Weidong Hao
Evaluation of Acute Tonic Cold Pain From Microwave Transcranial Transmission Signals Using Multi-Entropy Machine Learning Approach. IEEE Access 8 (2020)
Miao Cai, Peng Cui, Yikang Qin, Daoshuang Geng, Qiqin Wei, Xiyou Wang, Dao-Guo Yang, Guoqi Zhang
Entropy Generation Methodology for Defect Analysis of Electronic and Mechanical Components - A Review. Entropy 22 (2) (2020)
Daoshuang Geng, Dao-Guo Yang, Miao Cai, Weidong Hao, Xiaoming Li
Detection of Acute Tonic Cold Pain From Microwave Transcranial Transmission Signals Obtained via the Microwave Scattering Approach. IEEE Access 7 (2019)
Miao Cai, Yonghu Liang, Minghui Yun, Xuan-You Chen, Haidong Yan, Zhaozhe Yu, Dao-Guo Yang, Guoqi Zhang
Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs. IEEE Access 7 (2019)
Miao Cai, Zhi Liang, Kunmiao Tian, Minghui Yun, Ping Zhang, Dao-Guo Yang, Guoqi Zhang
Junction Temperature Prediction for LED Luminaires Based on a Subsystem-Separated Thermal Modeling Method. IEEE Access 7 (2019)
Ning Yang, Dao-Guo Yang, Guoqi Zhang, Liangbiao Chen, Dongjing Liu, Miao Cai, Xuejun Fan
The Effects of Graphene Stacking on the Performance of Methane Sensor: A First-Principles Study on the Adsorption, Band Gap and Doping of Graphene. Sensors 18 (2) (2018)
Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang
Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test. Reliab. Eng. Syst. Saf. 154 (2016)
Miao Cai, Dao-Guo Yang, Jianna Zheng, Jianlin Huang, Dongjing Liu, Jing Xiao, Ping Zhang, Guoqi Zhang, Xianping Chen
Effects of stress-loading test methods on the degradation of light-emitting diode modules. Microelectron. Reliab. 64 (2016)
Weijie Liang, Ping Zhang, Xianping Chen, Miao Cai, Dao-Guo Yang
Genetic Algorithm (GA)-Based Inclinometer Layout Optimization. Sensors 15 (4) (2015)
Zaifu Cui, Miao Cai, Ruifeng Li, Ping Zhang, Xianping Chen, Dao-Guo Yang
A numerical procedure for simulating thermal oxidation diffusion of epoxy molding compounds. Microelectron. Reliab. 55 (9-10) (2015)
Jianlin Huang, Dusan S. Golubovic, Sau Koh, Dao-Guo Yang, Xiupeng Li, Xuejun Fan, G. Q. Zhang
Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests. Microelectron. Reliab. 55 (12) (2015)
Miao Cai, Dao-Guo Yang, Kunmiao Tian, Ping Zhang, Xianping Chen, Lilin Liu, Guoqi Zhang
Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method. Microelectron. Reliab. 55 (9-10) (2015)
Miao Cai, D. J. Xie, W. B. Chen, B. Y. Wu, Dao-Guo Yang, G. Q. Zhang
A novel soldering method to evaluate PCB pad cratering for pin-pull testing. Microelectron. Reliab. 53 (9-11) (2013)
Dao-Guo Yang, F. F. Wan, Z. Y. Shou, Willem D. van Driel, H. Scholten, L. Goumans, Roberto Faria
Effect of high temperature aging on reliability of automotive electronics. Microelectron. Reliab. 51 (9-11) (2011)
Dao-Guo Yang, Martien Kengen, W. G. M. Peels, David Heyes, W. D. van Driel
Reliability modeling on a MOSFET power package based on embedded die technology. Microelectron. Reliab. 50 (7) (2010)
Hendrik Pieter Hochstenbach, Willem D. van Driel, Dao-Guo Yang, Jeroen J. M. Zaal, E. Bagerman
Designing for reliability using a new Wafer Level Package structure. Microelectron. Reliab. 50 (4) (2010)
W. D. van Driel, Dao-Guo Yang, G. Q. Zhang
On chip-package stress interaction. Microelectron. Reliab. 48 (8-9) (2008)
Miao Cai, Dao-Guo Yang, Wenbin Chen, Quan-Yong Li
An Optimum Design Method for Nonlinear System Using an Improved Neural Network. CSSE (1) (2008)
C. van't Hof, Kaspar M. B. Jansen, G. Wisse, Leo J. Ernst, Dao-Guo Yang, G. Q. Zhang, H. J. L. Bressers
Novel shear tools for viscoelastic characterization of packaging polymers. Microelectron. Reliab. 47 (2-3) (2007)
Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen
Numerical modeling of warpage induced in QFN array molding process. Microelectron. Reliab. 47 (2-3) (2007)
Willem D. van Driel, Dao-Guo Yang, Cadmus A. Yuan, M. van Kleef, G. Q. (Kouchi) Zhang
Mechanical reliability challenges for MEMS packages: Capping. Microelectron. Reliab. 47 (9-11) (2007)
Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. Microelectron. Reliab. 47 (2-3) (2007)
W. D. van Driel, Olaf van der Sluis, Dao-Guo Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang
Reliability modelling for packages in flexible end-products. Microelectron. Reliab. 46 (9-11) (2006)
Dao-Guo Yang, J. S. Liang, Quan-Yong Li, Leo J. Ernst, G. Q. Zhang
Parametric study on flip chip package with lead-free solder joints by using the probabilistic designing approach. Microelectron. Reliab. 44 (12) (2004)