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Reliability modeling on a MOSFET power package based on embedded die technology.
Dao-Guo Yang
Martien Kengen
W. G. M. Peels
David Heyes
W. D. van Driel
Published in:
Microelectron. Reliab. (2010)
Keyphrases
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cost effective
case study
power consumption
rapid development
key technologies
data processing
modeling method
software package
data sets
neural network
information retrieval
genetic algorithm
knowledge base
bayesian networks
user interface