W. D. van Driel

Publication Activity (10 Years)

Years Active: 2003-2018
Publications (10 Years): 6

Top Topics

Color Difference

Atmospheric Turbulence

Top Venues

Microelectron. Reliab.

Publications

M. Yazdan Mehr, M. R. Toroghinejad, F. Karimzadeh, W. D. van Driel, G. Q. Zhang
A review on discoloration and high accelerated testing of optical materials in LED based-products. Microelectron. Reliab. 81 (2018)
Guangjun Lu, W. D. van Driel, Xuejun Fan, Jiajie Fan, Cheng Qian, G. Q. Zhang
Color shift acceleration on mid-power LED packages. Microelectron. Reliab. 78 (2017)
M. Yazdan Mehr, M. R. Toroghinejad, F. Karimzadeh, W. D. van Driel, G. Q. Zhang
Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products. Microelectron. Reliab. 78 (2017)
W. D. van Driel, M. Schuld, B. Jacobs, F. Commissaris, J. van der Eyden, B. Hamon
Lumen maintenance predictions for LED packages. Microelectron. Reliab. 62 (2016)
Ee-Hua Wong, W. D. van Driel, A. Dasgupta, Michael G. Pecht
Creep fatigue models of solder joints: A critical review. Microelectron. Reliab. 59 (2016)
B. Hamon, W. D. van Driel
LED degradation: From component to system. Microelectron. Reliab. 64 (2016)
S. Tarashioon, W. D. van Driel, G. Q. Zhang
Multi-physics reliability simulation for solid state lighting drivers. Microelectron. Reliab. 54 (6-7) (2014)
M. Yazdan Mehr, W. D. van Driel, Kaspar M. B. Jansen, P. Deeben, G. Q. Zhang
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products. Microelectron. Reliab. 54 (1) (2014)
S. Tarashioon, Alessandro Baiano, Henk W. van Zeijl, C. Guo, S. W. Koh, W. D. van Driel, G. Q. Zhang
An approach to "Design for Reliability" in solid state lighting systems at high temperatures. Microelectron. Reliab. 52 (5) (2012)
Dao-Guo Yang, Martien Kengen, W. G. M. Peels, David Heyes, W. D. van Driel
Reliability modeling on a MOSFET power package based on embedded die technology. Microelectron. Reliab. 50 (7) (2010)
J. de Vries, W. Balemans, W. D. van Driel
Predictive modeling of board level shock-impact reliability of the HVQFN-family. Microelectron. Reliab. 50 (2) (2010)
Ee-Hua Wong, S. K. W. Seah, W. D. van Driel, J. F. J. M. Caers, N. Owens, Y.-S. Lai
Advances in the drop-impact reliability of solder joints for mobile applications. Microelectron. Reliab. 49 (2) (2009)
W. D. van Driel, Dao-Guo Yang, G. Q. Zhang
On chip-package stress interaction. Microelectron. Reliab. 48 (8-9) (2008)
Ee-Hua Wong, Ranjan Rajoo, S. K. W. Seah, C. S. Selvanayagam, W. D. van Driel, J. F. J. M. Caers, X. J. Zhao, N. Owens, L. C. Tan, M. Leoni, P. L. Eu, Y.-S. Lai, C.-L. Yeh
Correlation studies for component level ball impact shear test and board level drop test. Microelectron. Reliab. 48 (7) (2008)
Jeroen J. M. Zaal, W. D. van Driel, S. Bendida, Q. Li, J. T. M. van Beek, G. Q. Zhang
Packaging influences on the reliability of MEMS resonators. Microelectron. Reliab. 48 (8-9) (2008)
W. D. van Driel, A. Mavinkurve, M. A. J. van Gils, G. Q. Zhang
Advanced structural similarity rules for the BGA package family. Microelectron. Reliab. 47 (2-3) (2007)
H. J. L. Bressers, W. D. van Driel, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang
Correlation between chemistry of polymer building blocks and microelectronics reliability. Microelectron. Reliab. 47 (2-3) (2007)
Olaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, W. D. van Driel, M. A. J. van Gils
Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion. Microelectron. Reliab. 47 (12) (2007)
Xiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis, G. Q. Zhang
Characterization of moisture properties of polymers for IC packaging. Microelectron. Reliab. 47 (9-11) (2007)
M. van Soestbergen, Leo J. Ernst, Kaspar M. B. Jansen, W. D. van Driel
Measuring the through-plane elastic modulus of thin polymer films in situ. Microelectron. Reliab. 47 (12) (2007)
Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen
Numerical modeling of warpage induced in QFN array molding process. Microelectron. Reliab. 47 (2-3) (2007)
J. W. C. de Vries, M. Y. Jansen, W. D. van Driel
On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections. Microelectron. Reliab. 47 (2-3) (2007)
Artur Wymyslowski, W. D. van Driel, J. van de Peer, N. Tzannetakis, G. Q. Zhang
Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability. Microelectron. Reliab. 47 (2-3) (2007)
W. D. van Driel
Facing the challenge of designing for Cu/low-k reliability. Microelectron. Reliab. 47 (12) (2007)
M. A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen
Virtual qualification of moisture induced failures of advanced packages. Microelectron. Reliab. 47 (2-3) (2007)
R. L. J. M. Ubachs, Olaf van der Sluis, W. D. van Driel, G. Q. Zhang
Multiscale modelling of multilayer substrates. Microelectron. Reliab. 46 (9-11) (2006)
W. D. van Driel, Olaf van der Sluis, Dao-Guo Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang
Reliability modelling for packages in flexible end-products. Microelectron. Reliab. 46 (9-11) (2006)
W. D. van Driel, M. A. J. van Gils, Richard B. R. van Silfhout, G. Q. Zhang
Prediction of Delamination Related IC & Packaging Reliability Problems. Microelectron. Reliab. 45 (9-11) (2005)
W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi
Prediction and verification of process induced warpage of electronic packages. Microelectron. Reliab. 43 (5) (2003)