Advances in the drop-impact reliability of solder joints for mobile applications.
Ee-Hua WongS. K. W. SeahW. D. van DrielJ. F. J. M. CaersN. OwensY.-S. LaiPublished in: Microelectron. Reliab. (2009)
Keyphrases
- mobile applications
- mobile devices
- mobile phone
- mobile users
- user experience
- m learning
- context aware
- mobile environments
- mobile platform
- wireless technologies
- smart phones
- mobile services
- mobile platforms
- location based services
- wifi
- artificial intelligence
- wireless devices
- android platform
- interaction design
- wireless networks
- end users
- case study