S. K. W. Seah

Publication Activity (10 Years)

Years Active: 2008-2016
Publications (10 Years): 1

Top Topics

Mechanical Properties

Top Venues

Microelectron. Reliab.

Publications

Ee-Hua Wong, J. Chrisp, C. S. Selvanayagam, S. K. W. Seah
Constitutive modeling of solder alloys for drop-impact applications. Microelectron. Reliab. 67 (2016)
Ee-Hua Wong, S. K. W. Seah, W. D. van Driel, J. F. J. M. Caers, N. Owens, Y.-S. Lai
Advances in the drop-impact reliability of solder joints for mobile applications. Microelectron. Reliab. 49 (2) (2009)
Ee-Hua Wong, S. K. W. Seah, V. P. W. Shim
A review of board level solder joints for mobile applications. Microelectron. Reliab. 48 (11-12) (2008)
Ee-Hua Wong, Ranjan Rajoo, S. K. W. Seah, C. S. Selvanayagam, W. D. van Driel, J. F. J. M. Caers, X. J. Zhao, N. Owens, L. C. Tan, M. Leoni, P. L. Eu, Y.-S. Lai, C.-L. Yeh
Correlation studies for component level ball impact shear test and board level drop test. Microelectron. Reliab. 48 (7) (2008)