A review of board level solder joints for mobile applications.
Ee-Hua WongS. K. W. SeahV. P. W. ShimPublished in: Microelectron. Reliab. (2008)
Keyphrases
- mobile applications
- mobile devices
- m learning
- mobile phone
- user experience
- context aware
- location based services
- battery life
- mobile services
- mobile users
- mobile platforms
- mobile technologies
- smart phones
- mobile environments
- wireless technologies
- mobile platform
- wireless devices
- ubiquitous computing
- power consumption
- wifi
- wireless sensor networks