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Prediction and verification of process induced warpage of electronic packages.

W. D. van DrielG. Q. ZhangJ. H. J. JanssenLeo J. ErnstFei SuKerm Sin ChianSung Yi
Published in: Microelectron. Reliab. (2003)
Keyphrases
  • prediction accuracy
  • case study
  • real time
  • multiscale
  • search algorithm
  • evolutionary algorithm
  • process model
  • development process