J. H. J. Janssen

Publication Activity (10 Years)

Years Active: 2003-2018
Publications (10 Years): 1

Top Topics

Energy Consumption

Sparse Representation

Top Venues

Publications

Yanki Aslan, Jan Puskely, J. H. J. Janssen, Marcel Geurts, Antoine Roederer, Alexander Yarovoy
Thermal-Aware Synthesis of 5G Base Station Antenna Arrays: An Overview and a Sparsity-Based Approach. IEEE Access 6 (2018)
J. J. Koning, S. Lecaudey, E. Spaan, M. Stoutjesdijk, J. H. J. Janssen
Thermal heating within SOI. Microelectron. Reliab. 48 (8-9) (2008)
M. A. J. van Gils, Olaf van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken
Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectron. Reliab. 47 (2-3) (2007)
Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen
Numerical modeling of warpage induced in QFN array molding process. Microelectron. Reliab. 47 (2-3) (2007)
M. A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen
Virtual qualification of moisture induced failures of advanced packages. Microelectron. Reliab. 47 (2-3) (2007)
Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, H. J. L. Bressers, J. H. J. Janssen
Effect of filler concentration of rubbery shear and bulk modulus of molding compounds. Microelectron. Reliab. 47 (2-3) (2007)
Willem D. van Driel, C. J. Liu, G. Q. Zhang, J. H. J. Janssen, Richard B. R. van Silfhout, M. A. J. van Gils, Leo J. Ernst
Prediction of interfacial delamination in stacked IC structures using combined experimental and simulation methods. Microelectron. Reliab. 44 (12) (2004)
W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi
Prediction and verification of process induced warpage of electronic packages. Microelectron. Reliab. 43 (5) (2003)