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Analysis of Cu/low-k bond pad delamination by using a novel failure index.
M. A. J. van Gils
Olaf van der Sluis
G. Q. Zhang
J. H. J. Janssen
R. M. J. Voncken
Published in:
Microelectron. Reliab. (2007)
Keyphrases
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data analysis
data sets
database
statistical analysis
real world
website
multiscale
index structure