Olaf van der Sluis

Publication Activity (10 Years)

Years Active: 2006-2023
Publications (10 Years): 1

Publications

R. Willems, Evianne Kruithof, K. L. P. M. Janssens, Matthijs J. M. Cluitmans, Olaf van der Sluis, Peter H. M. Bovendeerd, Clemens V. Verhoosel
Isogeometric-Mechanics-Driven Electrophysiology Simulations of Ventricular Tachycardia. FIMH (2023)
Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu, François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van der Sluis, P. H. M. Timmermans
Design and implementation of flexible and stretchable systems. Microelectron. Reliab. 51 (6) (2011)
Sander Noijen, Roy Engelen, Joerg Martens, Alexandru Opran, Olaf van der Sluis, Richard B. R. van Silfhout
Prediction of the epoxy moulding compound aging effect on package reliability. Microelectron. Reliab. 50 (7) (2010)
Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont
A fast moisture sensitivity level qualification method. Microelectron. Reliab. 50 (9-11) (2010)
S. P. M. Noijen, Olaf van der Sluis, P. H. M. Timmermans, G. Q. Zhang
Numerical prediction of failure paths at a roughened metal/polymer interface. Microelectron. Reliab. 49 (9-11) (2009)
Olaf van der Sluis, R. A. B. Engelen, P. H. M. Timmermans, G. Q. Zhang
Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics. Microelectron. Reliab. 49 (8) (2009)
Cadmus A. Yuan, Olaf van der Sluis, Willem D. van Driel, G. Q. (Kouchi) Zhang
The need for multi-scale approaches in Cu/low-k reliability issues. Microelectron. Reliab. 48 (6) (2008)
J. Thijsse, Olaf van der Sluis, J. A. W. van Dommelen, Willem D. van Driel, Marc G. D. Geers
Characterization of semiconductor interfaces using a modified mixed mode bending apparatus. Microelectron. Reliab. 48 (3) (2008)
Cadmus A. Yuan, Olaf van der Sluis, G. Q. (Kouchi) Zhang, Leo J. Ernst, Willem D. van Driel, Richard B. R. van Silfhout
Molecular simulation on the material/interfacial strength of the low-dielectric materials. Microelectron. Reliab. 47 (9-11) (2007)
Olaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, W. D. van Driel, M. A. J. van Gils
Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion. Microelectron. Reliab. 47 (12) (2007)
M. A. J. van Gils, Olaf van der Sluis, G. Q. Zhang, J. H. J. Janssen, R. M. J. Voncken
Analysis of Cu/low-k bond pad delamination by using a novel failure index. Microelectron. Reliab. 47 (2-3) (2007)
Xiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis, G. Q. Zhang
Characterization of moisture properties of polymers for IC packaging. Microelectron. Reliab. 47 (9-11) (2007)
B. A. E. van Hal, Ron H. J. Peerlings, Marc G. D. Geers, Olaf van der Sluis
Cohesive zone modeling for structural integrity analysis of IC interconnects. Microelectron. Reliab. 47 (8) (2007)
R. L. J. M. Ubachs, Olaf van der Sluis, W. D. van Driel, G. Q. Zhang
Multiscale modelling of multilayer substrates. Microelectron. Reliab. 46 (9-11) (2006)
Cadmus A. Yuan, Willem D. van Driel, Richard B. R. van Silfhout, Olaf van der Sluis, Roy A. B. Engelen, Leo J. Ernst, Fred van Keulen, G. Q. Zhang
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectron. Reliab. 46 (9-11) (2006)
W. D. van Driel, Olaf van der Sluis, Dao-Guo Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang
Reliability modelling for packages in flexible end-products. Microelectron. Reliab. 46 (9-11) (2006)