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Prediction of the epoxy moulding compound aging effect on package reliability.
Sander Noijen
Roy Engelen
Joerg Martens
Alexandru Opran
Olaf van der Sluis
Richard B. R. van Silfhout
Published in:
Microelectron. Reliab. (2010)
Keyphrases
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software aging
prediction accuracy
prediction error
prediction algorithm
prediction model
wet lab
information systems
software engineering
predictive model
database
machine learning
feature extraction
reliability assessment