Bart Vandevelde

Publication Activity (10 Years)

Years Active: 2003-2017
Publications (10 Years): 3

Top Topics

Physical Sciences

Filtered Back Projection

Electron Microscopy

Top Venues

Microelectron. Reliab.

Publications

Abdellatif Bey-Temsamani, S. Kauffmann, Y. Descas, Bart Vandevelde, Franco Zanon, Geert Willems
Improved and accurate physics-of-failure (PoF) methodology for qualification and lifetime assessment of electronic systems. Microelectron. Reliab. (2017)
Bart Vandevelde, Filip Vanhee, Davy Pissoort, Lieven Degrendele, Johan de Baets, Bart Allaert, Ralph Lauwaert, Franco Zanon, Riet Labie, Geert Willems
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components. Microelectron. Reliab. 74 (2017)
Aidan Cowley, Andrej Ivankovic, C. S. Wong, N. S. Bennett, A. N. Danilewsky, Marcel Gonzalez, Vladimir Cherman, Bart Vandevelde, Ingrid De Wolf, P. J. McNally
B-Spline X-Ray Diffraction Imaging - Rapid non-destructive measurement of die warpage in ball grid array packages. Microelectron. Reliab. 59 (2016)
Joke De Messemaeker, O. Varela Pedreira, A. Moussa, Nabi Nabiollahi, Kris Vanstreels, Stefaan Van Huylenbroeck, Harold Philipsen, Patrick Verdonck, Bart Vandevelde, Ingrid De Wolf, Eric Beyne, Kris Croes
Impact of oxide liner properties on TSV Cu pumping and TSV stress. IRPS (2015)
Bart Vandevelde, Andrej Ivankovic, B. Debecker, Melina Lofrano, Kris Vanstreels, Wei Guo, Vladimir Cherman, Marcel Gonzalez, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Zsolt Tokei
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. Microelectron. Reliab. 54 (6-7) (2014)
Andrej Ivankovic, Kris Vanstreels, Daniel Vanderstraeten, Guy Brizar, Renaud Gillon, Eddy Blansaer, Bart Vandevelde
Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging. Microelectron. Reliab. 52 (11) (2012)
H. A. C. Tilmans, Jeroen De Coster, P. Helin, Vladimir Cherman, A. Jourdain, P. De Moor, Bart Vandevelde, N. P. Pham, J. Zekry, Ann Witvrouw, Ingrid De Wolf
MEMS packaging and reliability: An undividable couple. Microelectron. Reliab. 52 (9-10) (2012)
Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT (2012)
Herman Oprins, Bart Vandevelde, Martine Baelmans
Modeling and Control of Electrowetting Induced Droplet Motion. Micromachines 3 (1) (2012)
Ingrid De Wolf, Kris Croes, O. Varela Pedreira, Riet Labie, Augusto Redolfi, M. Van De Peer, Kris Vanstreels, C. Okoro, Bart Vandevelde, Eric Beyne
Cu pumping in TSVs: Effect of pre-CMP thermal budget. Microelectron. Reliab. 51 (9-11) (2011)
Geert Van der Plas, Paresh Limaye, Igor Loi, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Antonio Pullini, Federico Angiolini, Luca Benini, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. IEEE J. Solid State Circuits 46 (1) (2011)
Herman Oprins, A. Srinivasan, Miroslav Cupák, Vladimir Cherman, Cristina Torregiani, Michele Stucchi, Geert Van der Plas, Paul Marchal, Bart Vandevelde, E. Cheng
Fine grain thermal modeling and experimental validation of 3D-ICs. Microelectron. J. 42 (4) (2011)
Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, W. Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte
Analysis of microbump induced stress effects in 3D stacked IC technologies. 3DIC (2011)
Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu, François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van der Sluis, P. H. M. Timmermans
Design and implementation of flexible and stretchable systems. Microelectron. Reliab. 51 (6) (2011)
Geert Van der Plas, Steven Thijs, Dimitri Linten, Guruprasad Katti, Paresh Limaye, Abdelkarim Mercha, Michele Stucchi, Herman Oprins, Bart Vandevelde, Nikolaos Minas, Miro Cupac, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal
Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions. CICC (2010)
Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne
Design issues and considerations for low-cost 3D TSV IC technology. ISSCC (2010)
Mario Gonzalez, Fabrice Axisa, Mathieu Vanden Bulcke, Dominique Brosteaux, Bart Vandevelde, Jan Vanfleteren
Design of metal interconnects for stretchable electronic circuits. Microelectron. Reliab. 48 (6) (2008)
Herman Oprins, J. Danneels, B. Van Ham, Bart Vandevelde, Martine Baelmans
Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling. Microelectron. J. 39 (7) (2008)
Artur Wymyslowski, Bart Vandevelde, Dag Andersson
Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Microelectron. Reliab. 47 (2-3) (2007)
Nele Van Steenberge, Paresh Limaye, Geert Willems, Bart Vandevelde, Inge Schildermans
Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly. Microelectron. Reliab. 47 (2-3) (2007)
Bart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev, Eric Beyne
Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages. Microelectron. Reliab. 47 (2-3) (2007)
Bart Vandevelde, Dag Andersson
Package and solder joint reliability analysed by FEM simulation and experiments. Microelectron. Reliab. 44 (12) (2004)
Marcel Gonzalez, Bart Vandevelde, R. Van Hoof, Eric Beyne
Characterization and FE analysis on the shear test of electronic materials. Microelectron. Reliab. 44 (12) (2004)
Bart Vandevelde, Dominiek Degryse, Eric Beyne, Eric Roose, Dorina Corlatan, Guido Swaelen, Geert Willems, Filip Christiaens, Alcatel Bell, Dirk Vandepitte
Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packages. Microelectron. Reliab. 43 (2) (2003)