Abdelkarim Mercha

Publication Activity (10 Years)

Years Active: 2004-2017
Publications (10 Years): 1

Top Topics

Metal Oxide Semiconductor

Power Dissipation

Shape Variability

Top Venues

Publications

Trong Huynh Bao, Julien Ryckaert, Zsolt Tokei, Abdelkarim Mercha, Diederik Verkest, Aaron Voon-Yew Thean, Piet Wambacq
Statistical Timing Analysis Considering Device and Interconnect Variability for BEOL Requirements in the 5-nm Node and Beyond. IEEE Trans. Very Large Scale Integr. Syst. 25 (5) (2017)
Trong Huynh Bao, Sushil Sakhare, Julien Ryckaert, Dmitry Yakimets, Abdelkarim Mercha, Diederik Verkest, Aaron Voon-Yew Thean, Piet Wambacq
Design technology co-optimization for enabling 5nm gate-all-around nanowire 6T SRAM. ICICDT (2015)
Nathalie Fievet, Praveen Raghavan, Rogier Baert, Frédéric Robert, Abdelkarim Mercha, Diederik Verkest, Aaron Thean
Impact of device and interconnect process variability on clock distribution. ICICDT (2015)
Kazuyuki Tomida, Keizo Hiraga, Morin Dehan, Geert Hellings, Doyoung Jang, Kenichi Miyaguchi, Thomas Chiarella, Minsoo Kim, Anda Mocuta, Naoto Horiguchi, Abdelkarim Mercha, Diederik Verkest, Aaron Thean
Impact of fin shape variability on device performance towards 10nm node. ICICDT (2015)
Bertrand Parvais, Piet Wambacq, Abdelkarim Mercha, Diederik Verkest, Aaron Thean, Ken Sawada, Kazuki Nomoto, Tetsuya Oishi, Hiroaki Ammo
A digital intensive circuit for low-frequency noise monitoring in 28nm CMOS. A-SSCC (2015)
Marie Garcia Bardon, P. Schuddinck, Praveen Raghavan, Doyoung Jang, Dmitry Yakimets, Abdelkarim Mercha, Diederik Verkest, Aaron Thean
Dimensioning for power and performance under 10nm: The limits of FinFETs scaling. ICICDT (2015)
Kenichi Miyaguchi, Bertrand Parvais, Lars-Åke Ragnarsson, Piet Wambacq, Praveen Raghavan, Abdelkarim Mercha, Anda Mocuta, Diederik Verkest, Aaron Thean
Modeling FinFET metal gate stack resistance for 14nm node and beyond. ICICDT (2015)
Dmitry Yakimets, Doyoung Jang, Praveen Raghavan, Geert Eneman, Hans Mertens, P. Schuddinck, Arindam Mallik, Marie Garcia Bardon, Nadine Collaert, Abdelkarim Mercha, Diederik Verkest, Aaron Thean, Kristin De Meyer
Lateral NWFET optimization for beyond 7nm nodes. ICICDT (2015)
Praveen Raghavan, Marie Garcia Bardon, Doyoung Jang, P. Schuddinck, Dmitry Yakimets, Julien Ryckaert, Abdelkarim Mercha, Naoto Horiguchi, Nadine Collaert, Anda Mocuta, Dan Mocuta, Zsolt Tokei, Diederik Verkest, Aaron Thean, A. Steegen
Holisitic device exploration for 7nm node. CICC (2015)
Julien Ryckaert, Praveen Raghavan, Rogier Baert, Marie Garcia Bardon, M. Dusa, Arindam Mallik, Sushil Sakhare, B. Vandewalle, Piet Wambacq, Bharani Chava, Kris Croes, Morin Dehan, Doyoung Jang, P. Leray, T.-T. Liu, Kenichi Miyaguchi, Bertrand Parvais, P. Schuddinck, P. Weemaes, Abdelkarim Mercha, Jürgen Bömmels, N. Horiguchi, G. McIntyre, Aaron Thean, Zsolt Tokei, S. Cheng, Diederik Verkest, A. Steegen
Design Technology co-optimization for N10. CICC (2014)
Trong Huynh Bao, Dmitry Yakimets, Julien Ryckaert, Ivan Ciofi, Rogier Baert, Anabela Veloso, Jürgen Bömmels, Nadine Collaert, Philippe Roussel, S. Demuynck, Praveen Raghavan, Abdelkarim Mercha, Zsolt Tokei, Diederik Verkest, Aaron Thean, Piet Wambacq
Circuit and process co-design with vertical gate-all-around nanowire FET technology to extend CMOS scaling for 5nm and beyond technologies. ESSDERC (2014)
Arindam Mallik, Paul Zuber, Tsung-Te Liu, Bharani Chava, Bhavana Ballal, Pablo Royer Del Bario, Rogier Baert, Kris Croes, Julien Ryckaert, Mustafa Badaroglu, Abdelkarim Mercha, Diederik Verkest
TEASE: a systematic analysis framework for early evaluation of FinFET-based advanced technology nodes. DAC (2013)
Doyoung Jang, Marie Garcia Bardon, Dmitry Yakimets, Kenichi Miyaguchi, An De Keersgieter, Thomas Chiarella, Romain Ritzenthaler, Morin Dehan, Abdelkarim Mercha
STI and eSiGe source/drain epitaxy induced stress modeling in 28 nm technology with replacement gate (RMG) process. ESSDERC (2013)
Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT (2012)
Geert Van der Plas, Paresh Limaye, Igor Loi, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Antonio Pullini, Federico Angiolini, Luca Benini, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. IEEE J. Solid State Circuits 46 (1) (2011)
Geert Eneman, J. Cho, V. Moroz, Dragomir Milojevic, M. Choi, Kristin De Meyer, Abdelkarim Mercha, Eric Beyne, Thomas Hoffmann, Geert Van der Plas
An analytical compact model for estimation of stress in multiple Through-Silicon Via configurations. DATE (2011)
Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, W. Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte
Analysis of microbump induced stress effects in 3D stacked IC technologies. 3DIC (2011)
Geert Van der Plas, Steven Thijs, Dimitri Linten, Guruprasad Katti, Paresh Limaye, Abdelkarim Mercha, Michele Stucchi, Herman Oprins, Bart Vandevelde, Nikolaos Minas, Miro Cupac, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal
Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions. CICC (2010)
Wen-Chieh Wang, Zue-Der Huang, Geert Carchon, Abdelkarim Mercha, Stefaan Decoutere, Walter De Raedt, Chung-Yu Wu
45-nm Planar bulk-CMOS 23-GHz LNAs with high-Q above-IC inductors. ISCAS (2010)
Nikolaos Minas, Ingrid De Wolf, Erik Jan Marinissen, Michele Stucchi, Herman Oprins, Abdelkarim Mercha, Geert Van der Plas, Dimitrios Velenis, Pol Marchal
3D integration: Circuit design, test, and reliability challenges. IOLTS (2010)
Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne
Design issues and considerations for low-cost 3D TSV IC technology. ISSCC (2010)
Vaidyanathan Subramanian, Abdelkarim Mercha, Bertrand Parvais, Morin Dehan, Guido Groeseneken, Willy M. C. Sansen, Stefaan Decoutere
Identifying the Bottlenecks to the RF Performance of FinFETs. VLSI Design (2010)
Jonathan Borremans, Steven Thijs, Morin Dehan, Abdelkarim Mercha, Piet Wambacq
Low-cost feedback-enabled LNAs in 45nm CMOS. ESSCIRC (2009)
Jan Van Olmen, Jan Coenen, Wim Dehaene, Kristin De Meyer, Cedric Huyghebaert, Anne Jourdain, Guruprasad Katti, Abdelkarim Mercha, Michal Rakowski, Michele Stucchi, Youssef Travaly, Eric Beyne, Bart Swinnen
3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV). 3DIC (2009)
Thomas Chiarella, Liesbeth Witters, Abdelkarim Mercha, Christoph Kerner, Rok Dittrich, Michal Rakowski, Claude Ortolland, Lars-Åke Ragnarsson, Bertrand Parvais, A. De Keersgieter, S. Kubicek, A. Redolfi, R. Rooyackers, C. Vrancken, S. Brus, A. Lauwers, Philippe Absil, S. Biesemans, Thomas Y. Hoffmann
Migrating from planar to FinFET for further CMOS scaling: SOI or bulk? ESSCIRC (2009)
Domagoj Siprak, Piet Wambacq, Bertrand Parvais, Abdelkarim Mercha, Michael Fulde, Jesenka Veledar Kruger, Morin Dehan, Stefaan Decoutere
FinFET RF receiver building blocks operating above 10 GHz. ESSCIRC (2009)
Piet Wambacq, Abdelkarim Mercha, Karen Scheir, Bob Verbruggen, Jonathan Borremans, Vincent De Heyn, Steven Thijs, Dimitri Linten, Geert Van der Plas, Bertrand Parvais, Morin Dehan, Stefaan Decoutere, Charlotte Soens, Nadine Collaert, Malgorzata Jurczak
Advanced Planar Bulk and Multigate CMOS Technology: Analog-Circuit Benchmarking up to mm-Wave Frequencies. ISSCC (2008)
Michael Fulde, Abdelkarim Mercha, Cedric Gustin, Bertrand Parvais, Vaidyanathan Subramanian, Klaus von Arnim, Florian Bauer, Klaus Schruefer, Doris Schmitt-Landsiedel, Gerhard Knoblinger
Analog design challenges and trade-offs using emerging materials and devices. ESSCIRC (2007)
Kerem Akarvardar, Abdelkarim Mercha, Eddy Simoen, Vaidyanathan Subramanian, Cor Claeys, Pierre Gentil, Sorin Cristoloveanu
High-temperature performance of state-of-the-art triple-gate transistors. Microelectron. Reliab. 47 (12) (2007)
Bertrand Parvais, Vaidyanathan Subramanian, Abdelkarim Mercha, Morin Dehan, Piet Wambacq, Willy Sansen, Guido Groeseneken, Stefaan Decoutere
FinFET technology for analog and RF circuits. ICECS (2007)
Piet Wambacq, Bob Verbruggen, Karen Scheir, Jonathan Borremans, Morin Dehan, Dimitri Linten, Vincent De Heyn, Geert Van der Plas, Abdelkarim Mercha, Bertrand Parvais, Cedric Gustin, Vaidyanathan Subramanian, Nadine Collaert, Malgorzata Jurczak, Stefaan Decoutere
The Potential of FinFETs for Analog and RF Circuit Applications. IEEE Trans. Circuits Syst. I Regul. Pap. (11) (2007)
Bertrand Parvais, S. Hu, Morin Dehan, Abdelkarim Mercha, Stefaan Decoutere
An Accurate Scalable Compact Model for the Substrate Resistance of RF MOSFETs. CICC (2007)
Kiyoteru Hayama, Kenichiro Takakura, K. Shigaki, Hidenori Ohyama, Joan Marc Rafí, Abdelkarim Mercha, Eddy Simoen, Cor Claeys
Impact on the back gate degradation in partially depleted SOI n-MOSFETs by 2-MeV electron irradiation. Microelectron. Reliab. 46 (9-11) (2006)
Joan Marc Rafí, Eddy Simoen, Kiyoteru Hayama, Abdelkarim Mercha, Francesca Campabadal, Hidenori Ohyama, Cor Claeys
Hot-carrier-induced degradation of drain current hysteresis and transients in thin gate oxide floating body partially depleted SOI nMOSFETs. Microelectron. Reliab. 46 (9-11) (2006)
Stefaan Decoutere, Piet Wambacq, Vaidy Subramanian, Jonathan Borremans, Abdelkarim Mercha
Technologies for (sub-) 45nm Analog/RF CMOS - Circuit Design Opportunities and Challenges. CICC (2006)
Abdelkarim Mercha
Technology and architecture for deep submicron RF CMOS technology. SBCCI (2005)
Kiyoteru Hayama, Kenichiro Takakura, Hidenori Ohyama, S. Kuboyama, S. Matsuda, Joan Marc Rafí, Abdelkarim Mercha, Eddy Simoen, Cor Claeys
Radiation source dependence of performance degradation in thin gate oxide fully-depleted SOI n-MOSFETs. Microelectron. Reliab. 45 (9-11) (2005)
Dimitri Linten, Steven Thijs, Mahadeva Iyer Natarajan, Piet Wambacq, Wutthinan Jeamsaksiri, Javier Ramos, Abdelkarim Mercha, Snezana Jenei, Stéphane Donnay, Stefaan Decoutere
A 5-GHz fully integrated ESD-protected low-noise amplifier in 90-nm RF CMOS. IEEE J. Solid State Circuits 40 (7) (2005)
Wutthinan Jeamsaksiri, Abdelkarim Mercha, Javier Ramos, Stefaan Decoutere, Florence Cubaynes
Test Structure Design for a Selected Frequency Range. IEICE Trans. Electron. (5) (2005)
Dimitri Linten, Xiao Sun, Steven Thijs, M. I. Natarajan, Abdelkarim Mercha, Geert Carchon, Piet Wambacq, Takeshi Nakaie, Stefaan Decoutere
Low-power low-noise highly ESD robust LNA, and VCO design using above-IC inductors. CICC (2005)
Dimitri Linten, Xiao Sun, Geert Carchon, Wutthinan Jeamsaksiri, Abdelkarim Mercha, Javier Ramos, Snezana Jenei, Piet Wambacq, Morin Dehan, Lars Aspemyr, Andries J. Scholten, Stefaan Decoutere, Stéphane Donnay, Walter De Raedt
Low-power voltage-controlled oscillators in 90-nm CMOS using high-quality thin-film postprocessed inductors. IEEE J. Solid State Circuits 40 (9) (2005)
Dimitri Linten, Xiao Sun, Geert Carchon, Wutthinan Jeamsaksiri, Abdelkarim Mercha, Javier Ramos, Snezana Jenei, Lars Aspemyr, Andries J. Scholten, Piet Wambacq, Stefaan Decoutere, Stéphane Donnay, Walter De Raedt
A 328 μW 5 GHz voltage-controlled oscillator in 90 nm CMOS with high-quality thin-film post-processed inductor. CICC (2004)
Dimitri Linten, Steven Thijs, Mahadeva Iyer Natarajan, Piet Wambacq, Wutthinan Jeamsaksiri, Javier Ramos, Abdelkarim Mercha, Snezana Jenei, Stéphane Donnay, Stefaan Decoutere
A 5 GHz fully integrated ESD-protected low-noise amplifier in 90 nm RF CMOS. ESSCIRC (2004)
Kiyoteru Hayama, Kenichiro Takakura, Hidenori Ohyama, Abdelkarim Mercha, Eddy Simoen, Cor Claeys, Joan Marc Rafí, Michael Kokkoris
Degradation of electrical performance and floating body effect in ultra thin gate oxide FD-SOI n-MOSFETs by 7.5-MeV proton irradiation. Microelectron. Reliab. 44 (9-11) (2004)