Cedric Huyghebaert

Publication Activity (10 Years)

Years Active: 2009-2021
Publications (10 Years): 5

Top Topics

Silicon Dioxide

Semiconductor Devices

Top Venues

Publications

Cheng Han Wu, Steven Brems, Didit Yudistira, Daire Cott, A. Milenin, Kevin Vandersmissen, A. Maestre, A. Centeno, Joris Van Campenhout, Cedric Huyghebaert, Marianna Pantouvaki
Graphene electro-absorption modulators integrated at wafer-scale in a CMOS fab. VLSI Circuits (2021)
Chiara Alessandri, Inge Asselberghs, Peter De Heyn, Steven Brems, Cedric Huyghebaert, Joris Van Campenhout, Dries Van Thourhout, Marianna Pantouvaki
4-Channel C-Band WDM Transmitter Based on 10 GHz Graphene-Silicon Electro-Absorption Modulators. OFC (2019)
Chiara Alessandri, Inge Asselberghs, Yoojin Ban, Steven Brems, Cedric Huyghebaert, Joris Van Campenhout, Dries Van Thourhout, Marianna Pantouvaki
Broadband 20 Gbit/s Graphene-Si Electro-Absorption Modulator. ECOC (2018)
Tom Schram, Quentin Smets, Benjamin Groven, M. H. Heyne, E. Kunnen, A. Thiam, Katia Devriendt, Annelies Delabie, Dennis Lin, M. Lux, Daniele Chiappe, I. Asselberghs, S. Brus, Cedric Huyghebaert, S. Sayan, A. Juncker, Matty Caymax, Iuliana P. Radu
WS2 transistors on 300 mm wafers with BEOL compatibility. ESSDERC (2017)
Yashwanth Balaji, Quentin Smets, Cesar J. Lockhart de la Rosa, Anh Khoa Augustin Lu, Daniele Chiappe, Tarun Agarwal, Dennis Lin, Cedric Huyghebaert, Iuliana P. Radu, Dan Mocuta, Guido Groeseneken
Tunneling transistors based on MoS2/MoTe2 Van der Waals heterostructures. ESSDERC (2017)
Dries Van Thourhout, Yingtao Hu, Marianna Pantouvaki, K. Alexander, Bart Kuyken, Steven Brems, Inge Asselberghs, Cedric Huyghebaert, Chiara Alessandri, Philippe Absil, Joris Van Campenhout
Hybrid graphene-silicon photonics devices. ECOC (2015)
Jan Van Olmen, Jan Coenen, Wim Dehaene, Kristin De Meyer, Cedric Huyghebaert, Anne Jourdain, Guruprasad Katti, Abdelkarim Mercha, Michal Rakowski, Michele Stucchi, Youssef Travaly, Eric Beyne, Bart Swinnen
3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV). 3DIC (2009)