3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).
Jan Van OlmenJan CoenenWim DehaeneKristin De MeyerCedric HuyghebaertAnne JourdainGuruprasad KattiAbdelkarim MerchaMichal RakowskiMichele StucchiYoussef TravalyEric BeyneBart SwinnenPublished in: 3DIC (2009)