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Daire Cott
Publication Activity (10 Years)
Years Active: 2021-2023
Publications (10 Years): 6
Top Topics
Image Sensor
Semiconductor Manufacturing
Mathematical Analysis
Gate Insulator
Top Venues
DRC
VLSI Technology and Circuits
IRPS
VLSI Circuits
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Publications
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S. Kundu
,
D. H. van Doip
,
Tom Schram
,
Quentin Smets
,
S. Banerjee
,
Benjamin Groven
,
Daire Cott
,
S. Decoster
,
P. Bezard
,
F. Lazzarino
,
K. Banerjee
,
S. Ghosh
,
J. F. de Mamelfe
,
Pierre Morin
,
Cesar J. Lockhart de la Rosa
,
Inge Asselberghs
,
Gouri Sankar Kar
Towards low damage and fab-compatible top-contacts in MX2 transistors using a combined synchronous pulse atomic layer etch and wet-chemical etch approach.
VLSI Technology and Circuits
(2023)
S. Ghosh
,
Quentin Smets
,
S. Banerjee
,
Tom Schram
,
K. Kennes
,
R. Verheyen
,
P. Kumar
,
M.-E. Boulon
,
Benjamin Groven
,
H. M. Silva
,
S. Kundu
,
Daire Cott
,
Dennis Lin
,
P. Favia
,
T. Nuytten
,
A. Phommahaxay
,
Inge Asselberghs
,
C. De La Rosa
,
Gouri Sankar Kar
,
Steven Brems
Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer.
VLSI Technology and Circuits
(2023)
L. Panarella
,
Ben Kaczer
,
Quentin Smets
,
Devin Verreck
,
Tom Schram
,
Daire Cott
,
Dennis Lin
,
Stanislav Tyaginov
,
I. Asselberghs
,
Cesar J. Lockhart de la Rosa
,
Gouri Sankar Kar
,
Valeri Afanas'ev
Impact of gate stack processing on the hysteresis of 300 mm integrated WS2 FETs.
IRPS
(2023)
L. Panarella
,
Quentin Smets
,
D. Verreck
,
Tom Schram
,
Daire Cott
,
I. Asselberghs
,
Ben Kaczer
Analysis of BTI in 300 mm integrated dual-gate WS2 FETs.
DRC
(2022)
Dennis Lin
,
Xiangyu Wu
,
Vivek Mootheri
,
Daire Cott
,
Benjamin Groven
,
Pierre Morin
,
Inge Asselberghs
,
Iuliana P. Radu
On MX2-based metal-oxide-semiconductor device capacitance-voltage characteristics and dual-gate operation.
DRC
(2021)
Cheng Han Wu
,
Steven Brems
,
Didit Yudistira
,
Daire Cott
,
A. Milenin
,
Kevin Vandersmissen
,
A. Maestre
,
A. Centeno
,
Joris Van Campenhout
,
Cedric Huyghebaert
,
Marianna Pantouvaki
Graphene electro-absorption modulators integrated at wafer-scale in a CMOS fab.
VLSI Circuits
(2021)