Integration of epitaxial monolayer MX₂ channels on 300mm wafers via Collective-Die-To-Wafer (CoD2W) transfer.

S. Ghosh Quentin Smets S. Banerjee Tom Schram K. Kennes R. Verheyen P. Kumar M.-E. Boulon Benjamin Groven H. M. Silva S. Kundu Daire Cott Dennis Lin P. Favia T. Nuytten A. Phommahaxay Inge Asselberghs C. De La Rosa Gouri Sankar Kar Steven Brems

Published in: VLSI Technology and Circuits (2023)

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