Design issues and considerations for low-cost 3D TSV IC technology.
Geert Van der PlasParesh LimayeAbdelkarim MerchaHerman OprinsCristina TorregianiSteven ThijsDimitri LintenMichele StucchiGuruprasad KattiDimitrios VelenisDomae ShinichiVladimir ChermanBart VandeveldeVeerle SimonsIngrid De WolfRiet LabieDan PerryStephane BronckersNikolaos MinasMiro CupacWouter RuythoorenJan Van OlmenAlain PhommahaxayMuriel de Potter de ten BroeckAnn OpdebeeckMichal RakowskiBart De WachterMorin DehanMarc NelisRahul AgarwalWim DehaeneYoussef TravalyPol MarchalEric BeynePublished in: ISSCC (2010)