An analytical compact model for estimation of stress in multiple Through-Silicon Via configurations.
Geert EnemanJ. ChoV. MorozDragomir MilojevicM. ChoiKristin De MeyerAbdelkarim MerchaEric BeyneThomas HoffmannGeert Van der PlasPublished in: DATE (2011)
Keyphrases
- high level
- mathematical model
- experimental data
- maximum likelihood estimation
- formal model
- parameter estimation
- decision trees
- conceptual model
- theoretical analysis
- probability distribution
- neural network
- input data
- high speed
- low cost
- theoretical framework
- mobile robot
- cost function
- simulation model
- objective function