Geert Eneman

Publication Activity (10 Years)

Years Active: 2011-2022
Publications (10 Years): 9

Top Topics

Equivalent Circuit

Mobile Internet

Assessment Process

Quantum Computing

Top Venues

Microelectron. Reliab.

Publications

Kookjin Lee, Ben Kaczer, Anastasiia Kruv, Mario Gonzalez, Geert Eneman, Oguzhan O. Okudur, Alexander Grill, Jacopo Franco, Andrea Vici, Robin Degraeve, Ingrid De Wolf
Significant Enhancement of HCD and TDDB in CMOS FETs by Mechanical Stress. IRPS (2022)
Anabela Veloso, Geert Eneman, An De Keersgieter, P. Favia, Andriy Hikavyy, R. Chen, Anne Jourdain, N. Horiguchi
Innovations in Transistor Architecture and Device Connectivity for Advanced Logic Scaling. ICICDT (2022)
Stanislav Tyaginov, Alexander Makarov, Al-Moatasem Bellah El-Sayed, Adrian Chasin, Erik Bury, Markus Jech, Michiel Vandemaele, Alexander Grill, An De Keersgieter, Mikhail I. Vexler, Geert Eneman, Ben Kaczer
Understanding and Modeling Opposite Impacts of Self-Heating on Hot-Carrier Degradation in n- and p-Channel Transistors. IRPS (2022)
Shimpei Yamaguchi, Liesbeth Witters, Jérôme Mitard, Geert Eneman, Geert Hellings, Andriy Hikavyy, Roger Loo, Naoto Horiguchi
implant free quantum well pFET. Microelectron. Reliab. 83 (2018)
Mustafa Badaroglu, Jeff Xu, John Zhu, Da Yang, Jerry Bao, Seung-Chul Song, Peijie Feng, Romain Ritzenthaler, Hans Mertens, Geert Eneman, Naoto Horiguchi, Jeffrey Smith, Suman Datta, David Kohen, Po-Wen Chan, Keagan Chen, P. R. Chidi Chidambaram
PPAC scaling enablement for 5nm mobile SoC technology. ESSDERC (2017)
Nadine Collaert, AliReza Alian, H. Arimura, Geert Boccardi, Geert Eneman, Jacopo Franco, Tsvetan Ivanov, Dennis Lin, Jérôme Mitard, S. Ramesh, R. Rooyackers, Marc Schaekers, A. Sibaya-Hernandez, S. Sioncke, Quentin Smets, Abhitosh Vais, A. Vandooren, Anabela Veloso, Anne S. Verhulst, D. Verreck, Niamh Waldron, Amey Walke, Liesbeth Witters, H. Yu, X. Zhou, Aaron Voon-Yew Thean
Beyond-Si materials and devices for more Moore and more than Moore applications. ICICDT (2016)
Geert Eneman, A. De Keersgieter, Anda Mocuta, Nadine Collaert, Aaron Thean
FinFET stressor efficiency on alternative wafer and channel orientations for the 14 nm node and below. ICICDT (2015)
Dmitry Yakimets, Doyoung Jang, Praveen Raghavan, Geert Eneman, Hans Mertens, P. Schuddinck, Arindam Mallik, Marie Garcia Bardon, Nadine Collaert, Abdelkarim Mercha, Diederik Verkest, Aaron Thean, Kristin De Meyer
Lateral NWFET optimization for beyond 7nm nodes. ICICDT (2015)
Romain Ritzenthaler, Tom Schram, Geert Eneman, Anda Mocuta, Naoto Horiguchi, Aaron Voon-Yew Thean, Alessio Spessot, Marc Aoulaiche, Pierre Fazan, K. B. Noh, Y. Son
Assessment of SiGe quantum well transistors for DRAM peripheral applications. ICICDT (2015)
Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT (2012)
Jacopo Franco, Ben Kaczer, Jérôme Mitard, Maria Toledano-Luque, Felice Crupi, Geert Eneman, Ph. J. Rousse, Tibor Grasser, M. Cho, Thomas Kauerauf, Liesbeth Witters, Geert Hellings, L.-Å. Ragnarsson, Naoto Horiguchi, Marc M. Heyns, Guido Groeseneken
Superior reliability and reduced Time-Dependent variability in high-mobility SiGe channel pMOSFETs for VLSI logic applications. ICICDT (2012)
Geert Eneman, J. Cho, V. Moroz, Dragomir Milojevic, M. Choi, Kristin De Meyer, Abdelkarim Mercha, Eric Beyne, Thomas Hoffmann, Geert Van der Plas
An analytical compact model for estimation of stress in multiple Through-Silicon Via configurations. DATE (2011)
Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, W. Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte
Analysis of microbump induced stress effects in 3D stacked IC technologies. 3DIC (2011)