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Analysis of microbump induced stress effects in 3D stacked IC technologies.

Andrej IvankovicGeert Van der PlasV. MorozM. ChoiVladimir ChermanAbdelkarim MerchaPaul MarchalMarcel GonzalezGeert EnemanW. ZhangThibault BuissonMikael DetalleAntonio La MannaDiederik VerkestGerald BeyerEric BeyneBart VandeveldeIngrid De WolfDirk Vandepitte
Published in: 3DIC (2011)
Keyphrases
  • data analysis
  • databases
  • real time
  • statistical analysis
  • neural network
  • multimedia
  • three dimensional
  • open source
  • knowledge management
  • medical images
  • web technologies
  • future development
  • human factors