Analysis of microbump induced stress effects in 3D stacked IC technologies.

Andrej Ivankovic Geert Van der Plas V. Moroz M. Choi Vladimir Cherman Abdelkarim Mercha Paul Marchal Marcel Gonzalez Geert Eneman W. Zhang Thibault Buisson Mikael Detalle Antonio La Manna Diederik Verkest Gerald Beyer Eric Beyne Bart Vandevelde Ingrid De Wolf Dirk Vandepitte

Published in: 3DIC (2011)

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