Antonio La Manna

Publication Activity (10 Years)

Years Active: 2011-2015
Publications (10 Years): 2

Top Topics

Lessons Learned

Mechanical Design

Processing Cost

Top Venues

Publications

Dimitrios Velenis, Mikael Detalle, Geert Hellings, Mirko Scholz, Erik Jan Marinissen, Geert Van der Plas, Antonio La Manna, Andy Miller, Dimitri Linten, Eric Beyne
Processing active devices on Si interposer and impact on cost. 3DIC (2015)
Geert Hellings, Mirko Scholz, Mikael Detalle, Dimitrios Velenis, Muriel de Potter de ten Broeck, C. Roda Neve, Y. Li, Stefaan Van Huylenbroeck, Shih-Hung Chen, Erik Jan Marinissen, Antonio La Manna, Geert Van der Plas, Dimitri Linten, Eric Beyne, Aaron Thean
Active-lite interposer for 2.5 & 3D integration. VLSIC (2015)
Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT (2012)
Y. H. Hu, C. S. Liu, M. J. Lii, Kenneth J. Rebibis, Anne Jourdain, Antonio La Manna, Gerald Beyer, Eric Beyne, C. H. Yu
3D stacking using Cu-Cu direct bonding. 3DIC (2011)
Antonio La Manna, Dimitrios Velenis, Thibault Buisson, Mikael Detalle, Kenneth J. Rebibis, W. Zhang, Eric Beyne
3D stacking using ultra thin dies. 3DIC (2011)
Yuuki Araga, Makoto Nagata, Geert Van der Plas, Jaemin Kim, Nikolaos Minas, Pol Marchal, Youssef Travaly, Michael Libois, Antonio La Manna, Wenqi Zhang, Eric Beyne
In-tier diagnosis of power domains in 3D TSV ICs. 3DIC (2011)
Andrej Ivankovic, Geert Van der Plas, V. Moroz, M. Choi, Vladimir Cherman, Abdelkarim Mercha, Paul Marchal, Marcel Gonzalez, Geert Eneman, W. Zhang, Thibault Buisson, Mikael Detalle, Antonio La Manna, Diederik Verkest, Gerald Beyer, Eric Beyne, Bart Vandevelde, Ingrid De Wolf, Dirk Vandepitte
Analysis of microbump induced stress effects in 3D stacked IC technologies. 3DIC (2011)