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Yuuki Araga
ORCID
Publication Activity (10 Years)
Years Active: 2010-2021
Publications (10 Years): 8
Top Topics
Buffer Overflow
Analog Vlsi
Protection Schemes
Biometric Data
Top Venues
3DIC
IEICE Electron. Express
A-SSCC
EMC Compo
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Publications
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Yuuki Araga
,
Naoya Watanabe
,
Haruo Shimamoto
,
Katsuya Kikuchi
Analysis and evaluation of noise coupling between through-silicon-vias.
IEICE Electron. Express
18 (11) (2021)
Yuuki Araga
,
Ryo Kasai
,
Daisuke Tanaka
,
Yoshihide Murakami
,
Kyoshi Mihara
,
Kazuo Makida
,
Hiroki Sonoda
,
Makoto Nagata
,
Naoya Watanabe
,
Haruo Shimamoto
,
Katsuya Kikuchi
Landside capacitor efficacy among multi-chip-module using Si-interposer.
IEICE Electron. Express
18 (9) (2021)
Takuji Miki
,
Makoto Nagata
,
Hiroki Sonoda
,
Noriyuki Miura
,
Takaaki Okidono
,
Yuuki Araga
,
Naoya Watanabe
,
Haruo Shimamoto
,
Katsuya Kikuchi
Si-Backside Protection Circuits Against Physical Security Attacks on Flip-Chip Devices.
IEEE J. Solid State Circuits
55 (10) (2020)
Takuji Miki
,
Makoto Nagata
,
Akihiro Tsukioka
,
Noriyuki Miura
,
Takaaki Okidono
,
Yuuki Araga
,
Naoya Watanabe
,
Haruo Shimamoto
,
Katsuya Kikuchi
Over-the-top Si Interposer Embedding Backside Buried Metal PDN to Reduce Power Supply Impedance of Large Scale Digital ICs.
3DIC
(2019)
Yuuki Araga
,
Kikuchi Katsuya
,
Masahiro Aoyagi
Electrostatic Shield TSVs to Suppress Coupling Among Stacked ICs.
3DIC
(2019)
Takuji Miki
,
Makoto Nagata
,
Hiroki Sonoda
,
Noriyuki Miura
,
Takaaki Okidono
,
Yuuki Araga
,
Naoya Watanabe
,
Haruo Shimamoto
,
Katsuya Kikuchi
A Si-Backside Protection Circuits Against Physical Security Attacks on Flip-Chip Devices.
A-SSCC
(2019)
Yuuki Araga
,
Makoto Nagata
,
Joeri De Vos
,
Geert Van der Plas
,
Eric Beyne
A study on substrate noise coupling among TSVs in 3D chip stack.
IEICE Electron. Express
15 (13) (2018)
Yuuki Araga
,
Kikuchi Katsuya
,
Masahiro Aoyagi
Guard-ring monitoring system for inspecting defects in TSV-based data buses.
3DIC
(2015)
Yuuki Araga
,
Kikuchi Katsuya
,
Masahiro Aoyagi
Substrate monitoring system for inspecting defects in TSV-based data buses.
3DIC
(2014)
Yuuki Araga
,
Nao Ueda
,
Yasumasa Takagi
,
Makoto Nagata
Performance Evaluation of Probing Front-End Circuits for On-Chip Noise Monitoring.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
(12) (2013)
Akitaka Murata
,
Shuji Agatsuma
,
Daisaku Ikoma
,
Kouji Ichikawa
,
Takahiro Tsuda
,
Makoto Nagata
,
Kumpei Yoshikawa
,
Yuuki Araga
,
Yuji Harada
Noise analysis using on-chip waveform monitor in bandgap voltage references.
EMC Compo
(2013)
Takushi Hashida
,
Yuuki Araga
,
Makoto Nagata
A Diagnosis Testbench of Analog IP Cores for Characterization of Substrate Coupling Strength.
IEICE Trans. Electron.
(6) (2011)
Yuuki Araga
,
Makoto Nagata
,
Geert Van der Plas
,
Jaemin Kim
,
Nikolaos Minas
,
Pol Marchal
,
Youssef Travaly
,
Michael Libois
,
Antonio La Manna
,
Wenqi Zhang
,
Eric Beyne
In-tier diagnosis of power domains in 3D TSV ICs.
3DIC
(2011)
Takushi Hashida
,
Yuuki Araga
,
Makoto Nagata
A diagnosis testbench of analog IP cores against on-chip environmental disturbances.
VTS
(2011)
Yuuki Araga
,
Takushi Hashida
,
Makoto Nagata
An on-chip waveform capturing technique pursuing minimum cost of integration.
ISCAS
(2010)