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Over-the-top Si Interposer Embedding Backside Buried Metal PDN to Reduce Power Supply Impedance of Large Scale Digital ICs.

Takuji MikiMakoto NagataAkihiro TsukiokaNoriyuki MiuraTakaaki OkidonoYuuki AragaNaoya WatanabeHaruo ShimamotoKatsuya Kikuchi
Published in: 3DIC (2019)
Keyphrases
  • power supply
  • intelligent control
  • high frequency
  • high power
  • metal oxide
  • control unit
  • neural network
  • fuzzy logic
  • energy supply
  • image processing
  • multiscale
  • power consumption