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A study on substrate noise coupling among TSVs in 3D chip stack.

Yuuki AragaMakoto NagataJoeri De VosGeert Van der PlasEric Beyne
Published in: IEICE Electron. Express (2018)
Keyphrases
  • evolutionary algorithm
  • statistical analysis
  • low cost
  • random noise
  • real time
  • image sequences
  • empirical studies
  • noisy environments