Yann Civale

Publication Activity (10 Years)

Years Active: 2009-2013
Publications (10 Years): 0

Top Topics

Integrated Circuit

Cost Effectiveness

Top Venues

Publications

Yann Civale, Herman Meynen, Ranjith S. E. John, Peng-Fei Fu, Craig R. Yeakle, Sheng Wang, Stefan Krausse, Thomas Rapps, Stefan Lutter
Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits. 3DIC (2013)
Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT (2012)
Yann Civale, Marcel Gonzalez, Deniz Sabuncuoglu Tezcan, Youssef Travaly, Philippe Soussan, Eric Beyne
A novel concept for ultra-low capacitance via-last TSV. 3DIC (2010)
Yann Civale, Deniz Sabuncuoglu Tezcan, Harold G. G. Philipsen, P. Jaenen, Rahul Agarwal, F. Duval, Philippe Soussan, Youssef Travaly, Eric Beyne
Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping. 3DIC (2009)