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Ranjith S. E. John
Publication Activity (10 Years)
Years Active: 2013-2013
Publications (10 Years): 0
Top Topics
Sheet Metal
Integrated Circuit
Cost Effectiveness
Data Sources
Top Venues
3DIC
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Publications
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Yann Civale
,
Herman Meynen
,
Ranjith S. E. John
,
Peng-Fei Fu
,
Craig R. Yeakle
,
Sheng Wang
,
Stefan Krausse
,
Thomas Rapps
,
Stefan Lutter
Cost-effective temporary bonding and debonding material solution towards high-volume manufacturing 2.5D/3D through-silicon via integrated circuits.
3DIC
(2013)